As SoC design flows grow increasingly complex, IP-XACT has become a cornerstone standard throughout the entire development lifecycle: from architecture specification to design assembly and verification. Its growing adoption is reflected in the standard’s continuous evolution, from the 2009 release through 2014… Read More
Ceva Targets PC Gaming Audio Market With RealSpace Elevate for WindowsCeva has launched RealSpace™ Elevate for Windows, a…Read More
Applying QED to Hardware Accelerator Verification. Innovation in VerificationQED (Quick Error Detection) can be a powerful…Read More
From Tokens to Infrastructure: Why Compute, Memory, and Power Will Determine the Future of AIBased on Dylan Patel’s SEMI Industry Strategy Symposium…Read More
Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?Intel’s 18A process technology has become one of…Read MoreFeed Forward Intelligence: Enabling Testability in the Chiplets Era
The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining… Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More
RISC-V and AI: The Architecture Shift Is Now
The semiconductor industry has experienced several defining transitions over the last three decades. We moved from single-core to multicore processors, from ASIC-centric designs to IP-based SoCs, and from monolithic integration to heterogeneous architectures. Today, another transition is underway, one that may ultimately… Read More
MIPI Alliance Accelerates Automotive AI Connectivity with A-PHY Compliance Program
The automotive semiconductor industry is undergoing a major architectural transition as vehicles evolve into centralized, software-defined computing platforms capable of supporting advanced driver assistance systems (ADAS), autonomous driving, and AI-enabled cockpit applications. This shift is driving demand for… Read More
PowerArtist RTL Power Estimation Folds into Keysight
Back in the late 1990s, Sente launched a product called WattWatcher to estimate power from design RTL and simulation activity. This was revolutionary for its time since alternatives, while very accurate, only offered power analysis at the gate level. Gate-level analysis is great for fine-tuning power but is unhelpful for achieving… Read More
Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026
At the 2026 VLSI Symposium, Intel Foundry provided a detailed update on its process technology roadmap, highlighting the continued maturation of Intel 18A, the introduction of Intel 18A-P, and several advanced research initiatives that extend beyond current gate-all-around (GAA) transistor architectures. The presentation… Read More
GPU-native mask rule checking eliminates the curvilinear mask rule check bottleneck
As semiconductor manufacturing pushes toward advanced nodes with tighter feature sizes, the optical proximity correction (OPC) workflow is adopting curvilinear masks to achieve the larger process windows that traditional Manhattan geometries cannot deliver.
Traditional Manhattan masks constrain shapes to vertical … Read More
A tower-like heterogeneous packaging architecture for the AI era
For years, advanced packaging has been described mostly in planar terms: chiplets placed side by side, connected through interposers, bridges, redistribution layers, substrates, and short-reach electrical links. This view remains important. It supports today’s GPU, HBM, chiplet, and 2.5D integration architectures.… Read More
Akeana Collaborates with Samsung Electronics, Fast-Tracking RISC-V Customers and Ecosystem for Server and Agentic AI Silicon
The momentum behind RISC-V continues to accelerate as Akeana announced a strategic collaboration with Samsung Electronics aimed at reducing time-to-market for next-generation server and agentic AI silicon. The partnership combines Akeana’s high-performance RISC-V compute platform with Samsung Foundry’s advanced process… Read More


Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031