The problem of traditional FinFET Extension Implant doping concerns the awkward 3-dimensional structure of the fin. Because the Extension Implant defines the conductive electrical pathway between the Source/Drains and the undoped channel portion of the fin, it is essential that the fin be uniformly doped all three of its surfaces… Read More
WEBINAR: Revolutionizing Electrical Verification in IC DesignIn the complex world of IC design, electrical…Read More
Silicon Catalyst on the Road to $1 Trillion IndustryThere were quite a few announcements at the…Read More
Hierarchically defining bump and pin regions overcomes 3D IC complexityBy Todd Burkholder and Per Viklund, Siemens EDA…Read More
CDC Verification for Safety-Critical Designs – What You Need to KnowVerification is always a top priority for any…Read More
Ceva Unleashes Wi-Fi 7 Pulse: Awakening Instant AI Brains in IoT and Physical RobotsIn the rapidly evolving landscape of connected devices,…Read MoreTesla: The Day the Industry Stood Still
Tesla Motors held an investor event at its Palo Alto headquarters. CEO Elon Musk and a series of Tesla executives announced a new in-house developed microprocessor (already in production and being deployed in Tesla vehicles) and its plans and progress toward autonomous vehicle operation.
Tesla Autonomy Day Live Stream
To be … Read More
TSMC and Samsung 5nm Comparison
Samsung and TSMC have both made recent disclosures about their 5nm process and I though it would be a good time to look at what we know about them and compare the two processes.
A lot of what has been announced about 5nm is in comparison to 7nm so we will first review 7nm.
7nm
Figure 1 compares Samsung’s 7LPP process to TSMC’s 7FF and 7FFP… Read More
Webinar: ISO 26262 Compliance
To me the major idea of ISO 26262 compliance is ensuring that requirements can be traced throughout the entire design and verification process, including the use of IP blocks. The first market application that comes to mind with ISO 26262 is automotive, with its emphasis on safety because human lives are at stake. Since necessity… Read More
The Evolution of the Extension Implant Part II
The use of hard masks instead of photoresist for the Extension implant is an effective way to optimize the amount of dopant that is retained along the fin sidewalls for those fins that border along photoresist edges (as discussed in Part 1 of this series).
However, hard masks do nothing to address the dominant problem driving steeper… Read More
Complex Validation Requires Scalable Measures
The famous Olympic motto Citius, Altius, Fortius, which is the Latin words for “Faster, Higher, Stronger” to a considerable degree can be adapted to our electronics industry. Traditionally the fundamental metrics we used for measuring the quality of results (QoRs) are performance, power, and area (PPA). Amidst… Read More
Compute at the Edge
At first glance, this seems like a ho-hum topic- just use whatever Arm or RISC-V solution you need – but think again. We’re now expecting to push an awful lot of functionality into these edge devices. Our imaginations don’t care about power, performance and cost; everything should be possible so let’s keep adding cool features.… Read More
TSMC Technology Symposium Review Part II
TSMC recently held their annual Technology Symposium in Santa Clara. Part 1 of this article focused on the semiconductor process highlights. This part reviews the advanced packaging technologies presented at the symposium.
TSMC has clearly made a transition from a “pure” wafer-level foundry to a supplier of complex integrated… Read More
2019 TSMC Technology Symposium Review Part I
Each year, TSMC conducts two major customer events worldwide – the TSMC Technology Symposium in the Spring and the TSMC Open Innovation Platform Ecosystem Forum in the Fall. The Technology Symposium event was recently held in Santa Clara, CA, providing an extensive update on the status of advanced semiconductor and packaging… Read More
Free Webinar: Analog Verification with Monte Carlo, PVT Corners and Worst-Case Analysis
The letters “PVT” roll of the tongue easily enough, belying the complexity that variations in process, temperature and voltage can cause for analog designs. For semiconductor processes, there are dozens of parameters that can affect the viability of a design. It would be easy enough to optimize a circuit with only one or two varying… Read More


An Insight into Building Quantum Computers