Tallat M. Shafaat is CEO and co-founder of Vectara, an enterprise AI company that helps organizations build AI applications capable of retrieving information and generating reliable, grounded responses. Prior to founding Vectara, he worked at Google, contributing to its Search and Ads infrastructure, including the Knowledge… Read More
NVHBM: Can Custom HBM Change Who Builds the Memory Stack?NVIDIA's NVHBM could change more than how memory…Read More
Why Video Processing Matters for the Next Generation of RobotsMobilint has begun mass production of next-generation edge…Read More
CXO Interview with Solaiman Rahim of ChipAgentsDr. Solaiman Rahim is a multidisciplinary technology executive…Read More
Three-Dimensional Chess Anyone? The Challenges of Power Integrity for Multi-Die DesignsPower integrity has been a substantial design challenge…Read More
CTO Interview with Ed Plowman of Imagination TechnologiesEd Plowman is Chief Technology Officer at Imagination…Read MoreWEBINAR: Porting, Analysing & Optimising AI Models onto Edge GPUs
Modern AI models are opening up new possibilities at the edge. Turning those possibilities into responsive, efficient applications, however, requires more than choosing hardware with an impressive TOPS figure. Developers need to understand how models behave on their target devices, where performance is lost, and which optimisations… Read More
CEO Interview with Jun Yuan of Arcas-Tech
JUN YUAN BIO
◆Engineer for chip design, simulation, and P&R at AMD; Senior Engineer for chip verification (emulation, equivalence checking, formal verification) at Motorola since 1992.
◆Held R&D and technical management roles in formal verification EDA at Verplex, Jasper, and Cadence since 2003.
◆Founded Arcas-tech… Read More
CEO Interview with Pratap Ranade of Arena Physica
Pratap Ranade is CEO and Co-Founder of Arena Physica. Pratap first trained as a physicist at Stanford and Columbia before joining McKinsey as an Associate Partner advising tech and semiconductor companies. He then founded Kimono Labs, backed by Sam Altman, Peter Thiel and Y-Combinator, which was acquired by Palantir. There,… Read More
Interview with David Tester VP of Engineering Mach42
David Tester is the VP of Engineering at Mach42, with 30 years of experience in semiconductor development, engineering leadership, and business growth. As Chief Engineer at EnSilica, he helped transform the company from a design consultancy into a publicly listed fabless semiconductor business, scaling the organisation … Read More
Glass Is Becoming an AI Infrastructure Platform
The value of glass will be determined not by its material properties alone, but by whether it can expand the package architecture window and be realized repeatedly at manufacturing scale.
AI infrastructure is pushing advanced packaging into a regime where the substrate itself increasingly determines what can be built.
As packages… Read More
The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival
The philosophy of relying on a single, unified IP stack to lower your total cost of ownership is not a new concept invented just for the AI era. Semiconductor engineering teams have been weighing the trade-offs of piecemeal versus integrated intellectual property sourcing for decades. In previous process generations, veering… Read More
CTO Interview with Taylor Barton of Certus Semiconductor
Taylor Barton is a Lead Analog/Mixed-Signal and I/O IC Design Engineer at Certus Semiconductor, where he has worked since December 2022. He has designed more than 20 silicon-proven I/O and ESD libraries and has led analog and I/O IP projects, including ADC and SerDes designs. Taylor holds B.S. and M.S. degrees in Electrical Engineering… Read More
Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design Complexity
By Defacto Staff
Today’s chips are no longer just processors, they are entire systems. A System-on-Chip (SoC) brings together CPU clusters, accelerators, memories, interconnects and dozens of peripherals, often coming from many different teams and vendors. With AI, high-performance computing and IoT driving demand for … Read More
Reimagining 3D IC Design: From Architecture to Signoff
By Keith Felton, Andras Vass-Varnai and Todd Burkholder, Siemens EDA
The semiconductor industry is undergoing a fundamental transformation. Heterogeneous integration, the practice of combining multiple chiplets and specialized components into a single advanced packaging platform, has emerged as a powerful alternative… Read More


Jensen Huang and the Cost of Unchecked Influence