IPs have an attack surface that indicates how they can be compromised in real world scenarios. Some portions of the attack surfaces are well known, others are discovered during analysis, testing or out in the field. SoCs that use large collections of IPs need a systematic and reliable way to determine the various security vulnerabilities… Read More
Agentic Bug Localization. Innovation in VerificationBug localization continues to be a challenge for…Read More
Why chip design needs industrial-grade EDA AIBy Niranjan Sitapure Artificial intelligence (AI) is reshaping…Read MoreWebinar – AI/ML SoC Memory and Interconnect IP Perspectives
For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More
Design Perspectives on Intermittent Faults
Bugs are an inescapable reality in any but the most trivial designs and usually trace back to very deterministic causes – a misunderstanding of the intended spec or an incompletely thought-through implementation of some feature, either way leading to reliably reproducible failure under the right circumstances. You run diagnostics,… Read More
5G Deployments – The Analysis Requirements are Ginormous
The introduction of 5G communications support offers tremendous potential across a broad spectrum of applications (no pun intended). 5G is indeed quite encompassing, across a wide range of frequencies – the figure below illustrates the common terminology used, from low-band, mid-band (“sub 6G”), and high-band (“mmWave”)… Read More
A Future Vision for 3D Heterogeneous Packaging
At the recent Open Innovation Platform® Ecosystem Forum in Santa Clara, TSMC provided an enlightening look into the future of heterogeneous packaging technology. Although the term chiplet packaging is often used to describe the integration of multiple silicon die of potentially widely-varying functionality, this article… Read More
A Review of TSMC’s OIP Ecosystem
Each year, TSMC conducts two events – the Technology symposium in the Spring and the Open Innovation Platform (OIP) ® Ecosystem Forum in the Fall. Yet, what is the OIP ecosystem? What does it encompass? And, how does the program differentiate TSMC from other foundries? At the recent OIP Forum in Santa Clara, Suk Lee, Senior Director,… Read More
SiFive Continues to Foster RISC-V in the Middle East With Tech Symposiums
Workshops Coming to Istanbul, Amman, Cairo and Abu Dhabi
SiFive is continuing its tour through the Middle East with highly educational RISC-V Tech Symposiums and Workshops in the key locations of Istanbul, Amman and Cairo. These cities are some of the most technologically advanced in the region, and we are eager to collaborate… Read More
Workflow Automation Applied to IP Lifecycle Management
I often blog about a specific EDA tool, or an IP block, but the way that SoC design teams approach their designs and then use tools and IP can either be a manual, ad-hoc process, or part of something that is well-documented, following a design methodology. Back in the 1980’s while at Intel our team first created a design methodology… Read More
The GF Pivot, Specialization Defined
On August 27, 2018, GLOBALFOUNDRIES (GF) announced that they were no longer going to compete in the race to the next smaller semiconductor node, at that time, the 7nm node. While surprising to some, on further analysis this move made sense. TSMC had announced its plan to invest around $25B in the 5nm technology node. GF revenue is … Read More
Synopsys and Infineon prepare for expanding AI use in automotive applications
We all know that cars are using processors for many tasks, but it is easy to fail to comprehend just how many there are in a typical modern car. Browsing through the Infineon AURIX automotive processor application guide, you can start to see just how pervasive processors are. The AURIX processors are specifically designed for automotive… Read More




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