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Apple M5 Cu-Cu hybrid bonding

N

NY_Sam2

Member
From M1 Max’s silicon bridge with micro-bumps to M5’s Cu–Cu hybrid bonding, Apple is pushing interconnect technology to the next level. By separating CPU and GPU and reconnecting them through advanced bonding, Apple is not just scaling performance—it’s redefining how chips communicate at the package level.

This is no longer just chip design.
It’s system architecture through packaging.

Apple M5 Cu-Cu hybrid bonding
. 1 slide at 2026-Apr-ICEP-HBS in Japan by John Rau of Unimicron, photo by Jett C.
. "shipped in 2026-Mar"
. Intel EMIB-T, another version with Cu-Cu hybrid bonding? if so, when?
. source = https://www.linkedin.com/posts/jett...olving-from-activity-7451205629236502528-qzT1

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