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Dynamic Spectrum Allocation to Help Crowded IoT Airwaves

Dynamic Spectrum Allocation to Help Crowded IoT Airwaves
by Tom Simon on 06-26-2019 at 10:00 am

Radio frequency bandwidth has become a precious commodity, with communications companies paying top dollar for prized pieces of the spectrum. However, many radio bands are not often used efficiently. Many existing radio protocols exchange data on a fixed pair of frequencies, tying up those frequencies for other users. When… Read More


Micron beats subdued guidance on output cuts

Micron beats subdued guidance on output cuts
by Robert Maire on 06-26-2019 at 5:00 am

2020 capex likely down at least 20% vs 2019 DRAM & NAND price drops versus slowing capacity. Investors happy cause it could have been worse.

Micron reported $1.05 in Non-GAAP EPS beating street consensus of $0.79 by $0.26. While this looks like a big beat, we would remind investors that estimates for the quarter were about… Read More


Upcoming HBM and CDM ESD Verification Seminar in Taiwan

Upcoming HBM and CDM ESD Verification Seminar in Taiwan
by Tom Simon on 06-25-2019 at 10:00 am

The electrostatic discharge that occurs in lightening, as seen in the picture below, can cause serious damage to the objects on the ground. Over centuries mankind has devised ways, such as lighting rods and arresters, to deflect the energy so it is dissipated harmlessly. The same drama plays out on modern semiconductors due to … Read More


Eta Compute Showcases Continuously Tuned DVFS

Eta Compute Showcases Continuously Tuned DVFS
by Bernard Murphy on 06-25-2019 at 6:00 am

If you practice in advanced levels of power management, you know about dynamic voltage and frequency scaling (DVFS). This is where you allow some part of a circuit, say a CPU, to run at different voltages and frequencies depending on acceptable performance versus thermal tradeoffs and battery life on a mobile device. Need to run… Read More


Lithography For Advanced Packaging Equipment

Lithography For Advanced Packaging Equipment
by Robert Castellano on 06-24-2019 at 10:00 am

Advanced IC packaging, such as fan-out WLP (Wafer Level Packaging) and 2.5D TSV (Through Silicon Via) will drive the packaging equipment market, particularly lithography. This will help specific equipment manufacturers in 2019, since the WFE (Wafer Front End) market will drop 17%. But the Back-End lithography market, led … Read More


1971 is the year that Intel changed the world

1971 is the year that Intel changed the world
by John East on 06-24-2019 at 5:00 am

The “20 Questions with John East” series continues

From time to time I present the History of Silicon Valley as I saw it to various audiences.  I always enjoy doing that.  I’ve learned that the part that audiences like the most is the Apple / Steve Jobs story.  That’s not hard to understand.  Steve Jobs was truly fascinating! The story… Read More


FPGA Prototyping for AI Product Development

FPGA Prototyping for AI Product Development
by Randy Smith on 06-21-2019 at 8:00 am

I recently wrote about The Implications of the Rise of AI/ML in the Cloud. In that article, I wrote about my expectation that the rapidly growing AI market will lead to the accelerated use of high-level synthesis (HLS), prototyping, and emulation. In this article, I will focus on the prototyping portion of that – specifically FPGA… Read More


#56thDAC Discussion on Calibre in the Cloud Brings Sunshine to SOC Developers

#56thDAC Discussion on Calibre in the Cloud Brings Sunshine to SOC Developers
by Tom Simon on 06-20-2019 at 10:00 am

It was inevitable that EDA applications would meet the cloud. EDA has a long history of creating some of the most daunting compute challenges. This arises from employing current generation chips to design the next generation chips. Despite growing design complexity, many tools have kept pace and even reduced runtimes from generation… Read More


ARM Spins New IP for Client Applications

ARM Spins New IP for Client Applications
by Bernard Murphy on 06-20-2019 at 5:00 am

Arm is a machine. They crank out new products in a wide range of categories, Project Trillium for AI, Neoverse for infrastructure, their Automotive Enhanced line and the Pelion IoT platform. And in each they have a regular beat of new product introductions following roadmaps they have already laid out. Not that you’d expect any … Read More


SiP is the new SoC @ 56thDAC

SiP is the new SoC @ 56thDAC
by Tom Dillinger on 06-19-2019 at 6:48 pm

The emergence of 3D packaging technology has been accompanied by the term “more than Moore”, to reflect the increase in areal circuit density at a rate that exceeds the traditional IC scaling pace associated with Moore’s Law.  At the recent Design Automation Conference in Las Vegas, numerous exhibits on the vendor floor presented… Read More