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#57DAC – Panel Discussion of High Level Synthesis

#57DAC – Panel Discussion of High Level Synthesis
by Daniel Payne on 07-28-2020 at 10:00 am

sean dart, Cadence

Presenters took a trip down memory lane at DAC this year by having a panel discussion on HLS (High Level Synthesis) spanning from 1974 to 2020, and that time period aligns with when I first graduated from the University of Minnesota in 1978, starting chip design at Intel, then later transitioning into EDA companies by 1986. MarilynRead More


Low Power and RISC-V Talks at DAC2020, Hosted by Mentor

Low Power and RISC-V Talks at DAC2020, Hosted by Mentor
by Bernard Murphy on 07-28-2020 at 6:00 am

low battery

I’m going to get to low power and RISC-V, but first I’m trying out virtual DAC this year. Seems to be working smoothly, aside from some glitches in registration. But maybe that’s just me – I switched email addresses in the middle of the process. Some sessions are live, many pre-recorded, not quite the same interactive experience… Read More


A SoC Design Flow With IP-XACT

A SoC Design Flow With IP-XACT
by Ranjit Adhikary on 07-27-2020 at 10:00 am

soc flow with ipxact

Taping out a SoC is never easy. The physical dimensions of the chip often belie the work which has been done to get to the tapeout stage. And it is still not a done deal as the hardware and software development teams await the arrival of the test chip from the foundry to complete the post silicon bring-up and validation. The pressure on… Read More


Synopsys Webinar: A Comprehensive Overview of High-Speed Data Center Communications

Synopsys Webinar: A Comprehensive Overview of High-Speed Data Center Communications
by Mike Gianfagna on 07-27-2020 at 6:00 am

Screen Shot 2020 07 25 at 8.43.22 PM

High-speed communication is a critical component for many applications, most notably in the data center. The serializer/deserializer physical interface, or SerDes PHY is the backbone of many different forms of high-speed communication for this application. Use cases include on chip, between chips, between boards and racks… Read More


VLSI Symposium 2020 – Imec Buried Power Rail

VLSI Symposium 2020 – Imec Buried Power Rail
by Scotten Jones on 07-26-2020 at 10:00 am

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The 2020 VLSI Technology Symposium was held as a virtual conference from June 14th through June 19th. At the symposium Imec gave an interesting paper on Buried Power Rails (BPR) and I had a chance to interview one of the authors, Anshul Gupta.

As logic devices continue to scale down metal pitch is reaching a limit. Imec defines a pitch… Read More


The 10 Worst Cybersecurity Strategies

The 10 Worst Cybersecurity Strategies
by Matthew Rosenquist on 07-26-2020 at 8:00 am

The 10 Worst Cybersecurity Strategies

Counting down to the absolutely worst cybersecurity strategies. Sadly, these are all prevalent in the industry. Many organizations have failed spectacularly simply because they chose to follow a long-term path that leads to disaster. You know who you are…

Let’s count them down.

10. Cyber-Insurance

No need for security, … Read More


Cars and COVID-19 Uncertainty

Cars and COVID-19 Uncertainty
by Roger C. Lanctot on 07-26-2020 at 6:00 am

Cars and COVID 19 Uncertainty

A funny thing happens when you let car makers make cars and car dealers sell cars – people start buying cars. With the U.S. economy at least partially re-opening nationwide car buyers have returned to the market and, finding a limited supply of new cars and disappointing incentives, have turned, in part, to used cars. This … Read More


How yieldHUB Helps Bring a New Product to Market

How yieldHUB Helps Bring a New Product to Market
by Mike Gianfagna on 07-24-2020 at 10:00 am

Screen Shot 2020 07 14 at 4.01.42 PM

 

Collecting and analyzing semiconductor test data is a subject that holds a special place for me. Developing a factory data collection and analysis system was my first job out of school. The company was RCA, and the factories were in Findlay, Ohio (analog/mixed signal) and West Palm Beach, Florida (digital). There was a pilot… Read More


Thermo-compression bonding for Large Stacked HBM Die

Thermo-compression bonding for Large Stacked HBM Die
by Tom Dillinger on 07-24-2020 at 8:00 am

HMB stack

Summary

Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.

Introduction

The rapid growth of heterogeneous… Read More


Semiconductors up in 2020? Not so fast

Semiconductors up in 2020? Not so fast
by Bill Jewell on 07-24-2020 at 6:00 am

Semiconductor Forecast 2H 2020

Two months ago most forecasts called for a decline in the semiconductor market in 2020 as reported in our Semiconductor Intelligence May 2020 newsletter. The outlook changed in June, as the Worldwide Semiconductor Trade Statistics (WSTS) consensus forecast projected 3.3% growth in 2020. This month IC Insights revised its IC

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