As SoC complexities continue to expand to billions of transistors, the quest for higher levels of design automation also rises. This has led to the adoption of High-Level Synthesis (HLS), using design languages such as C++ and SystemC, which is more productive than traditional RTL design entry methods. In the RTL approach there… Read More
Mastering Atomic Precision – ALD’s Role in Semiconductor Advancements
Atomic layer deposition (ALD) is a thin-film deposition method that continues to enable continuous advances in semiconductor device fabrication. Essentially, it involves exposing substrates sequentially to at least two different vapor phase atmospheres in which self-limiting reactions take place on the surface: the first… Read More
WEBINAR: Redefining Security – The challenges of implementing Post-Quantum Cryptography (PQC)
In the late 1970s, cryptographic history saw the emergence of two seminal algorithms: McEliece and RSA. At that time, quantum threats were theoretical, and the selection criteria for cryptographic algorithms prioritized public key length and execution time, leading to RSA’s prominence while McEliece remained obscure… Read More
How IROC Makes the World a Safer Place with Unique Soft Error Analysis
I recently had an eye-opening discussion regarding the phenomena of soft errors in semiconductor devices. I always knew this could be a problem in space, where there are all kinds of high energy particles. What I didn’t realize is there are two trends that are making this kind of problem relevant on the ground as well as in space. The… Read More
Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures
The increasing demands of data-intensive applications necessitate more efficient storage and memory utilization. The rapid evolution of AI workloads, particularly with Generative AI (GenAI), demands infrastructure that can adapt to diverse computational needs. AI models vary widely in resource requirements, necessitating… Read More
TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More
Blank Wafer Suppliers are not Totally Blank
AI requires more Silicon capacity
Deep in the supply chain, some wizards turn sand into perfect diamond-structured crystal disks of silicon, which are necessary for the entire semiconductor supply chain.
They are part of the semiconductor supply chain, making Silicon Sand almost a thousand times more valuable.
The glimmer … Read More
Podcast EP227: The Significance of the RISC-V Movement and the Upcoming Andes RISC-V event with Mark Himelstein
Dan is joined by Mark Himelstein, President of Heavenstone. Most recently, as Chief Technology Officer at RISC-V International, Mark contributed to shaping RISC-V technology through visionary leadership and industry expertise. He has a track record of executive roles at Graphite Systems, Quantum, and Infoblox.
Dan discusses… Read More
Accelerate SoC Design: Addressing Modern Prototyping Challenges with S2C’s Comprehensive Solutions (II)
In the fast-paced world of Electronic Design Automation (EDA), the complexity of chip designs is continuously rising. With the burgeoning of systems such as 5G communication devices and Advanced Driver-Assistance Systems (ADAS) teeming with thousands of components, the demand for robust and efficient prototyping platforms… Read More
CEO Interview: Dieter Therssen of Sigasi
Dieter Therssen obtained his master’s degree in Electronics Engineering from KU Leuven in 1987. He started his career as a hardware design engineer, using IMEC’s visionary tools and design methodologies in the early days of silicon integration.
Since then, Dieter developed his career across many digital technologies,… Read More
AI Semiconductor Market