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At the 2021 VLSI Technology Symposium, Imec presented on Ruthenium (Ru) and Molybdenum (Mo) as alternate Word Line (WL) materials for 3D NAND Flash “First Demonstration of Ruthenium and Molybdenum Word lines Integrated into 40nm Pitch 3D NAND Memory Devices”. I had an opportunity to interview one of the authors: Maarten Rosmeulen.… Read More
One of the toughest tech tasks is adopting a new emerging technology that is fundamentally incompatible with the old. In the realm of connected cars, car makers and their suppliers labored for more than two decades on a wireless standard – called dedicated short-range communications (DSRC) – that was intended to enable intervehicle
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Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet