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Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®

Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®
by Daniel Nenni on 10-08-2025 at 8:00 am

ETC 2025 TSMC

In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon LiquidRead More


From Prompts to Prompt Engineering to Knowing Ourselves

From Prompts to Prompt Engineering to Knowing Ourselves
by Bernard Murphy on 10-08-2025 at 6:00 am

From prompts to Promt Engineering

I am on a voyage of discovery through prompting and prompting technologies because these are the critical interfaces between what we want (or roughly imagine we want) from AI, and AI’s ability to deliver. I have seen suggestions that any deficiencies today are a detail that will soon be overcome. I’m not so sure. Yes, prompting technology… Read More


GaN Device Design and Optimization with TCAD

GaN Device Design and Optimization with TCAD
by Daniel Payne on 10-07-2025 at 10:00 am

GaN Power, Frequency min

I’ve read articles about power electronics, RF systems and high-frequency applications using SiC and GaN transistors, especially in EVs and chargers, but hadn’t looked into the details of GaN devices. A recent Silvaco webinar proved to be just the format that I needed to learn more about GaN design and optimization. Udita Mittal,… Read More


How the Father of FinFETs Helped Save Moore’s Law

How the Father of FinFETs Helped Save Moore’s Law
by Daniel Nenni on 10-07-2025 at 8:00 am

Chenming Hu and Obama

In the early 2000s, Moore’s Law—the observation that the number of transistors on a chip doubles roughly every two years—was facing an existential crisis. As semiconductor nodes shrank below 90nm, planar transistors suffered from debilitating issues: leakage currents soared, power efficiency plummeted, and scaling became… Read More


A Remote Touchscreen-like Control Experience for TVs and More

A Remote Touchscreen-like Control Experience for TVs and More
by Bernard Murphy on 10-07-2025 at 6:00 am

touchless touchscreen

How do you control your smart TV? With a remote control of course, already quite capable since it allows voice commands to find a movie or TV show without needing all that fiddly button-based control and lookup. But there’s a range of things you can’t do that we take for granted on a tablet or phone screen. Point and click on an object,… Read More


Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award

Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award
by Daniel Nenni on 10-06-2025 at 10:00 am

TSMC 3D Fabric Packaging TSMC OIP 2025

In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More


Sofics’ ESD Innovations Power AI and Radiation-Hardened Breakthroughs on TSMC Platforms

Sofics’ ESD Innovations Power AI and Radiation-Hardened Breakthroughs on TSMC Platforms
by Daniel Nenni on 10-06-2025 at 6:00 am

Sofics TSMC OIP 2025 SemiWiki

In the fast-evolving semiconductor landscape, electrostatic discharge (ESD) protection is pivotal for ensuring chip reliability amid shrinking nodes and extreme applications. Sofics, a Belgian IP provider specializing in ESD solutions for ICs, has cemented its leadership through strategic collaborations showcased … Read More


MIN PULSE WIDTH (MPW) TIMING CHECK The Silent Timing Trap Lurking in Every Sub-5nm Design

MIN PULSE WIDTH (MPW) TIMING CHECK The Silent Timing Trap Lurking in Every Sub-5nm Design
by Admin on 10-05-2025 at 10:00 am

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By Zameer Mohammed

This article claims to provide clear key insights of Min Pulse Width (MPW) timing signoff check, proactive closure strategies for faster time-to-market, and effective methods to prevent silicon failures.

Min Pulse Width (MPW) check for timing signoff has become an important design constraint at the sub-5nmRead More


CEO Interview with Gary Spittle of Sonical

CEO Interview with Gary Spittle of Sonical
by Daniel Nenni on 10-05-2025 at 8:00 am

GarySpittle Sonical

British-born, California-based entrepreneur, Gary Spittle, is the founder of Sonical – a disruptive, forward-thinking audio brand that is currently on the cusp of delivering something quite remarkable: think immersive, wireless, and completely lossless.

Gary holds a PhD. He investigated the use of binaural audio for improving… Read More


Podcast EP309: The State of RISC-V and the Upcoming RISC-V Summit with Andrea Gallo

Podcast EP309: The State of RISC-V and the Upcoming RISC-V Summit with Andrea Gallo
by Daniel Nenni on 10-03-2025 at 10:00 am

Daniel is joined by Andrea Gallo, CEO of RISC-V International. Before joining RISC-V he worked in leadership roles at Linaro for over a decade and before Linaro he was a fellow at STMicroelectronics.

Dan explores the current state of the RISC-V movement with Andrea, who describes the focus and history of this evolving standard.… Read More