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PDF Solutions and the Value of Fearless CreativityPDF Solutions has been around for over 30…Read More
The demands of 5G requires new designs to not only save power but also increase performance and by moving to advance power-saving nodes and by using eFPGAs will help to achieve these goals. This paper will introduce 5G and O-RAN, the complexity of these systems, and how flexibility could be beneficial. Then we will dive into how eFPGA… Read More
The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects. Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes. The power, performance, and cost for each unit may be optimized separately.… Read More
SLAM – simultaneous localization and mapping – is already a well-established technology in robotics. This generally starts with visual SLAM, using object recognition to detect landmarks and obstacles. VSLAM alone uses a 2D view of a 3D environment, challenging accuracy; improvements depend on complementary sensing inputs… Read More
Dan is joined by semiconductor and EDA industry veteran Douglas Fairbairn. Doug provides details about MegaChips, where he currently heads business development. MegaChips is a large, successful 30-year old semiconductor company based in Japan.
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RISC-V processor IP is abundant. Open-source code for RISC-V is also widely available, but typically project-based code solves one specific problem. Using only pieces of code, it’s often up to a development team integrate a complete application-ready stack for creating an embedded device. A commercial embedded software development… Read More
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With time-to-market pressures ever increasing, companies are continually seeking enhanced designer productivity, faster design closure and improved project management efficiency. To accomplish these, organizations invest a lot in implementing both standardized approaches and proprietary techniques. With ever increasing… Read More
From initial process technology development (TD) to high volume manufacturing (HVM) status for a new node, one of the key support functions to improve and maintain yield is the in-line wafer inspection technology. Actually, there are multiple inspection technologies commonly employed, with tradeoffs in pixel resolution,… Read More
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Intel’s Pearl Harbor Moment