Anyone interested in learning about general trade compliance concepts or how export control and sanction regulations affect the electronic systems design ecosystem will want to attend the upcoming ESD Alliance export seminar. It will be hosted by Ada Loo, chair of the ESD Alliance Export Committee and Cadence’s Group Director… Read More





AAA Hypes Self-Driving Car Fears
The AAA (U.S. auto club) must have AGHD (attention-getting deficit disorder). The headline from the organization’s latest research is: “Fear of Self-Driving Cars is on the Rise.” That should straighten things out, right?
The survey was conducted across a representative sample of U.S. households, according to the reported… Read More
Deep thinking on compute-in-memory in AI inference
Neural network models are advancing rapidly and becoming more complex. Application developers using these new models need faster AI inference but typically can’t afford more power, space, or cooling. Researchers have put forth various strategies in efforts to wring out more performance from AI inference architectures,… Read More
WEBINAR: Secure messaging in a post-quantum world
In a recent marketing campaign, WhatsApp (and by extension, its parent company Meta) mocks the ubiquitous but unsecure messaging vehicle, SMS, saying anyone can read plain texts and mobile users should use some means of secure messaging. Apps like WhatsApp, Messenger, iMessage, and WeChat have each attracted over 1 billion … Read More
DSP Innovation Promises to Boost Virtual RAN Efficiency
5G is already real, though some of us are wondering why our phone connections aren’t faster. That perspective misses the real intent of 5G – to extend high throughput (and low latency) communication to a vast number and variety of edge devices beyond our phones. One notable application is Fixed Wireless Access (FWA), promising … Read More
Multi-Die Systems Key to Next Wave of Systems Innovations
These days, the term chiplets is referenced everywhere you look, in anything you read and in whatever you hear. Rightly so because the chiplets or die integration wave is taking off. Generally speaking, the tipping point that kicked off the move happened around the 16nm process technology when large monolithic SoCs started facing… Read More
Calibre IC Manufacturing papers at SPIE 2023
The Siemens Calibre group was very busy last week at SPIE. Calling Calibre industry leading really is an understatement. Calibre is one of the reasons Moore’s Law has continued to this day. This tool is legendary. You can get more information on the Calibre landing page including product information, resource guide, blogs
Report from SPIE- EUV’s next 15 years- AMAT “Sculpta” braggadocio rollout
-We attended the SPIE lithography Conference in San Jose
-No significant news or announcements on EUV
-Focus on 500WPM target and High & Hyper NA rollout
-AMAT overblown Sculpta-Not exactly what its cracked up to be
SPIE Lithography 2023
We have been attending SPIE for many years now and are happy to see a return to pre Covid levels… Read More
Semiconductors and Mobile Communications: 5G and Beyond
Mobile World Congress (MWC) is the world’s largest gathering of mobile industry innovators where one can hear the latest on advanced technologies and solutions. This year, it took place from February 27 through March 2. Soitec was there to share their insights on how mobile communications are going to evolve with 5G and beyond … Read More
Podcast EP146: How Rapid Silicon Will Change Innovation with Naveed Sherwani
Dan is joined by Dr. Naveed Sherwani, a well-known semiconductor industry veteran with over 35 years of entrepreneurial, engineering, and management experience. He is widely recognized as an innovator and leader in the field of design automation of ASICs and microprocessors. Naveed now serves as CEO of Rapid Silicon, aiming… Read More
Making Intel Great Again!