Now that semiconductors are front page news and a political football, I would like to write more about how we got to where we are today to better understand where semiconductors will go tomorrow. I will start this article with a provocative quote that really made me laugh and will put some context to what I am trying to accomplish here:… Read More




Podcast EP175: The Complexities of Compliance for a Worldwide Supply Chain with Chris Shrope
Dan is joined by Chris Shrope. Chris leads high tech product marketing at Model N, a compliance leader for high-tech manufacturers. Chris has deep experience defining product market fit and related new product development activities. He received his MBA and holds certifications in Economics, Law, Product Management and Marketing.… Read More
CEO Interview: Harry Peterson of Siloxit
Harry Peterson is a mixed-signal chip designer with a BS in Physics from Caltech. He managed IC design groups within Fairchild, Kodak, Philips, Northern Telecom, Toshiba and Pixelworks. During sabbaticals he helped fly experiments on NASA’s orbiting satellite observatory (OSO-8) and build telescopes in the Canary… Read More
Alphawave Semi Visit at #60DAC
On Wednesday at #60DAC I met Sudhir Mallya, Sr. VP Corporate Marketing at Alphawave Semi to get an update about what’s been happening at their IP company and with industry trends. The tagline for their company is: Accelerating the Connected World; and they have IP for connectivity, offer chiplet solutions, and even provide… Read More
Accellera and Clock Domain Crossing at #60DAC
Accellera sponsored a luncheon panel discussion at #60DAC, so I registered and attended to learn more about one of the newest working groups for Clock Domain Crossing (CDC). An overview of Accellera was provided by Lu Dai, then the panel discussion was moderated by Paul McLellan of Cadence, with the following panel members:
- Anupam
Application-Specific Lithography: Via Separation for 5nm and Beyond
With metal interconnect pitches shrinking in advanced technology nodes, the center-to-center (C2C) separations between vias are also expected to shrink. For a 5/4nm node minimum metal pitch of 28 nm, we should expect vias separated by 40 nm (Figure 1a). Projecting to 3nm, a metal pitch of 24 nm should lead us to expect vias separated… Read More
Qualitative Shift in RISC-V Targets Raises Verification Bar
I had grown comfortable thinking about RISC-V as a cost-saving and more flexible alternative to Intel/AMD or Arm in embedded applications. Where clearly it is already doing very well. But following a discussion with Dave Kelf and Adnan Hamid of Breker, RISC-V goals have become much more ambitious, chasing the same big system applications… Read More
A Bold View of Future Product Development with Matt Genovese
Matt Genovese is the founder of Planorama Design, a software requirements and user experience design professional services company. The company designs simple and intuitive software and IoT product user interfaces for complex, technical applications and systems. Its unique and proven approach reduces client development… Read More
Agile Analog Visit at #60DAC
Chris Morrison, Director of Product Marketing at Agile Analog met with me on the Tuesday at DAC this year, and I asked what has changed in the last year for their analog IP business. The short answer is that the company has initially built up foundation IP for Analog Mixed-Signal (AMS) uses, then recently added new IP for data conversion,… Read More
Automated Code Review. Innovation in Verification
A little thinking outside the box this time. Microsoft is adding automation to their (and LinkedIn) code reviews; maybe we should consider this option also? Paul Cunningham (Senior VP/GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series… Read More
Should Intel be Split in Half?