Director – IC Yield and Product Engineering

Overview

Pragmatic is seeking an outstanding Director of IC Yield and Product Engineering to build and lead a team that will achieve industry benchmark performance across probe/sort/product test yield for existing products, and manage yield learning and yield optimisation for new products.

Reporting to the SVP Manufacturing & Operations, this is a key position with responsibility for leading the New Product Introduction (NPI) process to ensure new products seamlessly integrate into existing systems and processes, and accurately model yield for internal and foundry ICs. Working closely with various groups across Technology and Operations, this is a significant role for Pragmatic’s 300mm high volume manufacturing roadmap.

Key tasks

Ownership and responsibility for critical metrics including:

– All post-fab yields, especially probe/sort/product test yields for released products
– Yield learning rates for new and pre-release products, on existing and new technology nodes
– Accuracy of yield modelling predictions for new products

Management of key activities of the group, including:

– Root cause analysis of wafer-level product yields
– Correlations to PCM/e-test/WAT and into wafer fab
– Driving corrective actions through frontend and backend
– Partnering with Test Engineering to set efficient test limits and implement statistical yield limits and other controls as needed
– Work with Process Integration and Technology teams to ensure the Design for Manufacturing (DFM) process continually evolves to contribute towards elimination of layout/process marginalities
– Work with the Quality and Reliability groups to lead root cause analysis, material disposition (MRB), and corrective action identification
– Designing and analysing appropriate yield learning vehicles for optimisation of new wafer fab processes
– Specifying and optimising a Yield Management System (YMS)

Qualifications and training

• Bachelor’s degree in mechanical engineering or equivalent (essential)
• Master’s Degree or equivalent experience in Electrical / Electronic / Engineering or Physics (desirable)

Skills and experience

• Breadth and depth of experience in IC manufacturing, process integration, product engineering and/or yield improvement
• Deep expertise and experience in IC failure analysis, yield analysis and yield improvement at a top IC manufacturer (IDM or fabless)
• Strong communication, presentation, and interpersonal skills