SEMICON Japan 2024

Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, Japan

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 …

Chiplet Summit 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts and Analysts.  Show Movers and Shakers How Your Products and Roadmap Will Drive the Industry. Meet Highly Motivated Customer Prospects. …

Semiconductor Technology Overview

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …

Product Qualification Overview

Phoenix, AZ Phoenix, AZ, United States

Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …

IC Packaging Technology

Phoenix, AZ Phoenix, AZ, United States

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …

Advanced CMOS/FinFET Fabrication

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …