Addressing the challenges early-stage companies face on their quest for research and industrialization options on the way to mass production About this event 1 hour Join us Thursday, April 18 …
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Join us on April 23rd for the 2024 R1 updates to Ansys Charge Plus. The new and enhanced features include modeling and simulation capabilities for thermionic and e-field emissions, an automated workflow for …
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Versal Adaptive SoCs 101: Quick Start Guide to Integration and Implementation Workshop BLT Engineers have successfully deployed designs to Versal devices for Clients. Learn from the experts. This 4-hour online …
Join the Cadence and AWS teams for a hands-on workshop and networking event to learn about the Cadence Cerebrus SaaS on AWS. All attendees will receive a giveaway and a chance to …
Formal Verification Formal Verification can help you find bugs earlier in the design cycle and accelerate root cause analysis. But success with Formal requires the effective selection and implementation of …
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Every project has some areas that seem impossible to cover. Various factors can cause these nearly impossible-to-hit coverage gaps, including technical complexity, lack of resources, and shifting requirements. In constrained …
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Powering AI with Silicon and Embedded Leadership at TSMC 2024 Technology Symposium ACL Digital, an ALTEN group company, is excited to showcase its advanced semiconductor and embedded systems expertise at …
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Join us for the final webinar in the four-part series, which offers valuable insight into understanding how simulation can help to optimize gas turbine or furnace efficiency without compromising stability …
Continue reading "Accelerate Hydrogen Adoption Using Ansys Simulation: Part 4 – Utilization"
Managing the thermal aspects of electronics to avoid excessive heat buildup has a direct impact on reliability. By conducting thorough thermal analysis early in the design processes, engineers can identify problematic hot spots and optimize the appropriate heat dissipation mechanisms to ensure components operate in an appropriate temperature range. Avoiding excessive heat buildup helps ensure …
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DATE: Wednesday, April 24 TIME: 8:00am PDT | 11:00am EDT | 4:00pm BST | 8:30pm IST PSpice is a high-performance, industry-proven, mixed-signal simulator and waveform viewer for analog and mixed-signal circuits. As one of …
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Utilizing AWS cloud resources to accelerate variation-aware verification AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than …
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Embedded computing developers face new design challenges implementing high-speed protocols like 100 GbE, USB4, PCIe 5.0, DDR4/5, and more. This webinar introduces fundamental signal integrity concepts like insertion loss, return loss, and crosstalk, and relates them to a case study of the connector design for the COM-HPC Module Base Specification Revision 1.2 featuring the new …
Continue reading "Webinar: Signal Integrity for Embedded Computing Applications by Matthew Burns"
