March 4, 2020 12:00PM - 13:00PM (EST) Venue: Online As the automotive industry undergoes radical transformation with electrification and autonomy, there is an increasing need for semiconductor devices that last …
Continue reading "How to Design and Validate with AEC Grade 0"
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: (1) pitch conversion between the fine features of the IC die and …
Thu, Mar 5, 2020 10:00 AM - 10:45 AM MST In this webinar we will discuss best practice for traditional CFD meshing using Workbench mesher. Recommendations will be made regarding …
March 5, 2020 11:00 AM (EST) Venue: Online In this webinar, you’ll see how the Materials Data for Simulation dataset supports multiple simulation tools, including ANSYS Mechanical and ANSYS Maxwell. …
Continue reading "Consistent Materials Data for Simulation Across ANSYS Solvers"
CONFERENCE ARCHIVES 2019 – San Diego, California, USA Program PDF Conference Papers Technical Sessions Authors and Presiders View Presentations Previous Years The Premier Event in Telecom and Data Center Optics OFC …
Continue reading "The Optical Networking and Communication Conference & Exhibition (OFC)"
Double data rate (DDR) synchronous dynamic random-access memory (SDRAM) is the common type of memory used as RAM for almost every modern processor. With DDR memory interface voltages decreasing, speeds …
Continue reading "Webinar: Improving SI/PI Simulation of DDR Interfaces at the PCB/IC Package Level"
The DATE exhibition will run for three days (Tuesday-Thursday). The spacious exhibition area will be located close to the conference rooms in the heart of the Congress Center. As the …
Continue reading "Design, Automation and Test in Europe (DATE) 2020"
March 9, 2020 - March 10, 2020 9:00 AM - 5:00 PM (EST) Venue: ANSYS, Inc. 900 Victors Way Atrium One, Suite 350 Ann Arbor, MI 48108 USA Contact: Danielle …
Continue reading "Functional Safety Using ANSYS medini analyze Hands-On Training"
Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Continue reading "Semiconductor Reliability and Product Qualification"
The DATE exhibition will run for three days (Tuesday-Thursday). The spacious exhibition area will be located close to the conference rooms in the heart of the Congress Center. As the …
March 10-11 AI Hardware Summit Europe Munich, Germany Get the latest updates and technical specifications on InferX X1 Edge Inference Co-Processor
10 Mar 2020 - 12 Mar 2020 San Diego, CA, USA Join Cadence in Booth 5327 at the Optical Fiber Communication (OFC) Conference to explore how our photonics, RF, IP, …
