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Learn how to design lighter, stronger, and more efficient structures using advanced optimization techniques. Ideal for teams aiming to excel in engineering competitions, this webinar will equip teams with the …
Improve your student team’s use of CFD by learning best practices in properly setting up, running, and validating results and learning common mistakes made in CFD for your team to …
Join your fellow engineers and the Cadence Cloud team for an educational and networking event focused on developing a secure and scalable electronic design flow in the cloud. All attendees will receive a giveaway and a chance to win raffle prizes. DATE: August 20, 2024 TIME: 10:00am - 3:00pm PDT LOCATION: Cadence HQ | 2655 Seely Avenue San Jose, CA, 95134 | Building …
The Wembley – A St Giles Hotel
183, Jalan Magazine, George Town, George Town, Pulau Pinang, Malaysia
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s …
WELCOME TO EDI CON ONLINE EDUCATIONAL DAYS EDI CON Online takes place each year, bringing much needed technical training and information directly to engineers’ desktops and mobile devices. Free, real-time …
Join us for an in-depth exploration of our advanced NVH (Noise, vibration, and harshness) solutions. This webinar will showcase Ansys's advanced technologies and tools to help engineers tackle complex NVH …
Join us as we delve into the simulation of the dark count rate (DCR) in silicon SPADs using Ansys Lumerical CHARGE. Participants will learn about the workflow for simulating the …
Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s …
Stanford University
450 Jane Stanford Way, Stanford, CA, United States
Hot Chips 2024 will be held as a hybrid conference with in-person attendance at Memorial Auditorium, Stanford University from August 25 to 27, 2024. Conference Format Hot Chips 2024 is …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
Share Your Story Are you driving design change? Do you think you have successfully overcome challenges that could impact the electronics revolution? CadenceLIVE is here to share your story. Come show your expertise, share and provide professional tips to help engineers solve the complexities and challenges they face today. CadenceLIVE China 2024 China User Conference …