Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM …
Continue reading "Mastering Gearbox Durability: Advanced Simulation Techniques with Ansys"
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …
About this event Modern devices' growing complexity and the semiconductor industry's domain-specific nature have made intellectual property (IP) management essential. This webinar explores how Allegro Microsystems, a global leader in designing, developing, and manufacturing sensor integrated circuits (ICs) and application-specific analog power ICs, leveraged IP management to streamline innovation and efficiency. It delves into the …
Cutting Edge Advancements in 5G and 6G Technology Join us for a complimentary seminar and networking event on the latest advanced 5G and 6G technology! Our experts will provide updates on global spectrum regulation, 6G standardization, channel modeling for FR3, and sub-THz research. Explore the use of AI and ML in 6G research and its …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
Join us on February 13th for an in-depth look into how optical sensors are revolutionizing health monitoring in wearable devices, offering unprecedented accuracy and functionality for real-time physiological assessments. TIME: February 13th, 2025 Session One: 9:00am EST Session Two: 2:00pm EST Venue: Virtual Overview Join us for an in-depth look into how optical sensors are revolutionizing …
Continue reading "Webinar: Optical Sensors for Health Monitoring: Revolutionizing Wearable Devices"
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working …
Continue reading "2025 IEEE International Solid-State Circuits Conference (ISSCC)"
About the HPA Tech Retreat: The HPA Tech Retreat is unique among entertainment industry events, where world-class leaders in engineering, technology, creativity, and business step away from their daily routines to explore and experience the most compelling topics in content creation, management, and dissemination. This exclusive gathering fosters authentic discussions among experts, offering insights and …
About this event The NATE UNITE Annual Exposition & Conference is the only event in the United States to focus on communications infrastructure contractors, and the products, services, and technologies …
Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for …
Products evolve over time and often need to meet new and unexpected use cases and requirements. Register for this webinar and learn how to select the best materials to overcome engineering challenges and meet demanding customer requirements. TIME: February 18, 2025 11 AM EST / 5 PM CET / 9:30 PM IST Overview The optimal …
Continue reading "Webinar: Intelligent Material Selection to Meet Engineering Challenges"
FPGA Front Runner - Using AI in development and product for FPGA How are they used? What input language is used and how does it find it’s way into the …
Continue reading "FPGA Front Runner – Using AI in development and product for FPGA"
