Join us for a new approach to designing lumped-element filters and discover how easy such design can be while achieving the desired accuracy. TIME: January 28, 2025 11 AM EDT …
Engineers solve today’s challenges by leveraging simulation, and the Technical University of Madrid (UPM) addresses this need with its Master’s Degree in Numerical Simulation. Developed in collaboration with Ansys, the …
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Theme: Mixed Signal Verification Analog mixed signal chips continue to grow in both demand and complexity, and a consistent efficient verification approach remains a key topic for concern. This DVClub will …
Breakthroughs in photonics: network and innovate with leading experts and industrial players Why you should attend CEA-Leti leverages advances in semiconductors to enable far-reaching changes in photonic technologies. Join us …
Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Fresh New Name. Same Great Event. Introducing MD&M West Previously known as Informa Markets Engineering (IME) West, hosting five co-located shows — MD&M West, ATX West, D&M West, Plastec West, …
Join Comer Industries and Asotech in this webinar to see how Ansys simulations optimize gearbox durability and performance. DATE / TIME: February 4, 2025 10 AM EST / 4 PM …
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Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and …
Join us on February 13th for an in-depth look into how optical sensors are revolutionizing health monitoring in wearable devices, offering unprecedented accuracy and functionality for real-time physiological assessments. TIME: February …
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About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working …
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Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for …
