Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working …
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Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for …
FPGA Front Runner - Using AI in development and product for FPGA How are they used? What input language is used and how does it find it’s way into the …
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Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …
Beginning with 189 booths in 1987, SEMICON Korea has established itself as an exhibition representing the semiconductor industry thanks to the continuous growth of the Korean semiconductor industry. SEMICON Korea 2025 …
On February 20, 2025 in Cairo, Egypt, we are hosting the GSA MENA Executive Summit to look beyond the current divisions and rather recognize the Middle East North Africa regional potential as a …
Attend to hear research, challenges, and breakthroughs as you gather with colleagues in San Jose Join other leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications. REGISTER HERE
DVCON U.S. 2025 The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies and standards for the design and verification of electronic …
The World’s Premier Mineral Exploration & Mining Convention. The annual award winning PDAC Convention in Toronto, Canada brings together up to 30,000 attendees from over 130 countries for its educational …
The Congress The Lab of the Future Congress series interrogates the latest advances and drivers shaping life science research, development and manufacturing, and how these advances can be harnessed to …
Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, …
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Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2025 will once again provide a place where users and technical experts …
About Us For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants …
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DATE 2025 offers numerous opportunities to get in contact with the DATE community and to advertise their novel solutions. Download the DATE 2025 Promotion & Sponsorship Opportunities here DATE 2025 is the perfect opportunity …
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