WT | The Wearable Technologies Show 2024

Düsseldorf, Germany Düsseldorf, Germany

A must for anyone who is entering the medical market of wearables The world's biggest medical trade fair is the hotspot for wearable technologies in the healthcare segment where decision-makers from all over the world come together. At the WT | Wearables Technologies Joint Pavilion more than 45 exhibitors are showcasing which latest innovations and …

IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)

Huntsville Marriott at the Space & Rocket Center 5 Tranquility Base, Huntsville, AL, United States

About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The …

SEMICON Europa 2024

Messe Munchen Munich, Germany

SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support to the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the …

electronica 2024

Messe Munchen Munich, Germany

Your benefits as a visitor electronica covers the entire world of electronics. Here you can find high-performance systems and components from the micro- and nano-worlds of semiconductor and micro systems …

PCB Carolina 2024

McKimmon Center, NC State University 1101 Gorman St, Raleigh, NC, United States

About PCB Carolina Located in Raleigh (map) near Research Triangle Park makes this a prime area for this highly technical conference on electronics.  There will be 16 technical sessions, a keynote address, a vendor exhibition with over 70 companies participating, food throughout the day, and best of all, this event is FREE to all attendees. This is the place to …

Webinar: Efficient and Robust Memory Verification in Modern SoCs Using Formal Equivalence Checker

Online

With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. Traditional methods like SPICE simulation and cell-based formal verification have limitations; SPICE offers circuit-level accuracy but limited coverage, while cell-based methods can't fully represent transistor-level …

Webinar: Efficient and Robust Memory Verification in Modern SoCs Using Formal Equivalence Checker

Online

With the increasing complexity and importance of memories in modern ICs, there is a clear need for specialized tools and techniques for the design and verification of embedded memory blocks. Traditional methods like SPICE simulation and cell-based formal verification have limitations; SPICE offers circuit-level accuracy but limited coverage, while cell-based methods can't fully represent transistor-level …

Advanced Packaging Conference (APC) 2024

Messe Munchen Munich, Germany

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …

Webinar: Hands-On: How Financial Analysts Use AI PCs for Secure Gen AI Workloads

Online

Independent software vendors (ISVs) are unleashing a new wave of business innovation as they run AI directly on Intel® Core™ Ultra processors. By shifting AI workloads from the cloud to the client, businesses can lower SaaS costs, protect user privacy and data security, and enable novel use cases when AI has access to the full …

Webinar: AI-Driven Constraint Generation for PCB and IC Package Design

Online

While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is a driving force for the productivity necessary to address today’s compressed design cycles. Tight integration and complete automation are crucial to enhancing productivity and efficiency. …

Webinar: AI-Driven Constraint Generation for PCB and IC Package Design

Online

While constraint-driven design is not a new concept, the demand for automation and integration between design and analysis tools has grown with increasing design complexity. Optimizing constraints with AI/ML is a driving force for the productivity necessary to address today’s compressed design cycles. Tight integration and complete automation are crucial to enhancing productivity and efficiency. …