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Chips Are Going 3D, DRC Needs to Go 3D Too

Chips Are Going 3D, DRC Needs to Go 3D Too
by Paul McLellan on 02-10-2015 at 7:00 am

The last paradigm shift in DRC was around 0.35um when designs got too large to handle as flat data, and hierarchical approaches were required. Back then the design rules themselves were not that complex, the explosion of data volume came from the complexity of the design itself. But each process node added more design rules intricacies… Read More


FD-SOI at Samsung

FD-SOI at Samsung
by Paul McLellan on 02-08-2015 at 7:00 am

Various foundries have made announcements about licensing FD-SOI technology from ST Microelectronics and then fallen quiet. GlobalFoundries made an announcement a couple of years ago. Samsung made an announcement just before DAC last year. But neither company has said anything much since. Of course the big noise at 14/16nm… Read More


Inside tips on Tanner L-Edit toolbox

Inside tips on Tanner L-Edit toolbox
by Don Dingee on 02-02-2015 at 7:00 am

Advanced skill in auto repair, carpentry, plumbing, and similar trades often correlates to one factor. Knowing what you want to do is one thing – having the proper tool is another, and can make the difference. Many a job has extended from minutes to hours over the lack of the right tool at the right moment. Experienced mechanics and… Read More


STMicroelectronics and SoCs

STMicroelectronics and SoCs
by Majeed Ahmad on 01-29-2015 at 7:00 pm

What does system on chip (SoC) actually mean? How this tech moniker came into being? There is quite a bit of enigma about SoC in the technology press and what this term really stands for. Roger Shepherd, consultant at Parallel Computer Systems, shares on Quora his version of the SoC story. He says that he first heard about SoCs when … Read More


NoC 102: Using SonicsGN to Address Low Power Requirements From IoT to Servers

NoC 102: Using SonicsGN to Address Low Power Requirements From IoT to Servers
by Paul McLellan on 01-29-2015 at 7:00 am

At the end of last year, I moderated a Sonics webinar to introduce the concept of a network-on-chip or NoC. It was called NoC 101 and the replay is still available here.

Well it is a new year and time for chapter 2. I will be moderating a webinar next Wednesday February 4th at 10am pacific time. Once again the webinar itself will be delivered… Read More


Analyzing Power Nets

Analyzing Power Nets
by Paul McLellan on 01-21-2015 at 7:00 am

One of the big challenges in a modern SoC is doing an accurate analysis of the power nets. Different layers of metal have very different resistance characteristics (since they vary so much in width and height). Even vias can cause problems due to high resistance. Typically power is distributed globally on high-level metal layers,… Read More


FDSOI jump-start 2015 in Tokyo this week

FDSOI jump-start 2015 in Tokyo this week
by Eric Esteve on 01-19-2015 at 4:38 am

This news in May 2014 that Samsung had licensed FD-SOI Technology from ST-Microelectronics was really amazing, as most of the industry was expecting this kind of agreement, but not with the #2 SC Company. But since May 2014 the news flow has been quite reduced, we can imagine that both SC companies had a lot work to do for transforming… Read More


Johan Peeters on quick IP check through Cdiff

Johan Peeters on quick IP check through Cdiff
by Pawan Fangaria on 01-17-2015 at 8:00 am

On the face of it, if we consider a simple ‘diff’ utility, it doesn’t need any explanation; almost everyone in our community would have used it. But imagine the CTO of a company investing his time in explaining how beneficial a specialized ‘Cdiff’ function can be in evaluating IP. Today’s SoC design world can’t live without IP and … Read More


Twelve Years of Sonics at Toshiba

Twelve Years of Sonics at Toshiba
by Paul McLellan on 01-13-2015 at 7:00 am

Sonics announced today that Toshiba has completed the SoC design using Sonics’ on-chip network IP for its new TZ2100 group of application processors. The TZ2100 group of applications processors are the newest addition to Toshiba’s ApP Lite (Application Processor Lite) TZ2000 series. With this group of ApP Lite devices, sound… Read More


Coventor Panel at IEDM Digs into Variation Issues

Coventor Panel at IEDM Digs into Variation Issues
by Tom Simon on 01-05-2015 at 7:00 pm

Recently I attended a panel discussion on variability in semiconductor fabrication hosted by Coventor in conjunction with the IEEE IEDM conference in San Francisco. The IEEE bills the conference as “the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device… Read More