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-Intel’s access to high-NA EUV tools may be their elixir of life
-TSMC’s EUV adoption helped it vault faltering Intel & Samsung
-Maybe ASML should invest in Intel like Intel invested in ASML
-Shoe is on the other foot- But cooperation helps chip industry
Intel is dependent upon ASML for its entire future
If Intel… Read More
Having spent 40 years in the semiconductor industry, many years working with Arm and even publishing the definitive history book “Mobile Unleashed: The Origin and Evolution of ARM Processors in Our Devices” plus having spent more than 20 years working with China based companies, I found the recent Arm China media circus quite … Read More
The big fake news last week came from a report out of China stating that TSMC won a big Intel order for 3nm wafers. We have been talking about this for some time on SemiWiki so this is nothing new. Unfortunately, the article mentioned wafer and delivery date estimates that are unconfirmed and from what I know, completely out of line. … Read More
The 32nd VLSI Design/CAD Symposium just occurred in a virtual setting. The theme of the event this year was “ICs Powering Smart Life Innovation”. There were many excellent presentations across analog & RF, EDA & testing, digital & system, and emerging technology. There were also some excellent keynotes, and this… Read More
The annual VLSI Symposium provides unique insights into R&D innovations in both circuits and technology. Indeed, the papers presented are divided into two main tracks – Circuits and Technology. In addition, the symposium offers workshops, forums, and short courses, providing a breadth of additional information.
At… Read More
Apple’s recent Spring Loaded Event brought us M1-based iMacs. After the MacBook Air and 13” MacBook Pro in the fall, iMacs are the third Mac to jettison Intel processors. With this transition Apple’s T2 chip enters End of Life status, so to speak. The T2 is a bit of an enigma and now it does not have much time left.
We know it performs… Read More
At the 2021 Symposium on VLSI Technology and Circuits in June a short course was held on “Advanced Process and Devices Technology Toward 2nm-CMOS and Emerging Memory”. In this article I will review the first two presentations covering leading edge logic devices. The two presentations are complementary and provide and excellent… Read More
Semiconductor manufacturers are expanding capital spending in 2021 and beyond to help alleviate shortages. In addition, many governments around the world are proposing funding to support semiconductor manufacturing in their countries.
The United States Senate this month approved a bill which includes $52 billion to fund… Read More
At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps. Previous articles have reviewed the highlights of silicon process and packaging technologies. The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More
The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.
General
3DFabricTM
Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.
2.5D package technology – CoWoS
The 2.5D packaging options are divided into the CoWoS… Read More
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[_behaviors:protected] =>
)
)
[_previousValues:protected] => Array
(
)
[_options:protected] => Array
(
)
[_deleted:protected] =>
[_readOnly:protected] =>
[_writePending:protected] =>
[_writeRunning:protected] =>
[_errors:protected] => Array
(
)
[_whenSaveable:protected] => Array
(
)
[_cascadeSave:protected] => Array
(
)
[_behaviors:protected] =>
)
)
[populated:protected] => 1
)