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Synopsys Announces FlexEDA for the Cloud!

Synopsys Announces FlexEDA for the Cloud!
by Daniel Nenni on 03-30-2022 at 10:30 am

Synopsys Cloud Graphic

There’s been a lot of discussion and hype regarding use of the cloud for chip design for quite a while, more than ten years I would say. I spoke with Synopsys to better understand their recent Synopsys Cloud announcement to determine if it is different. Briefly, it is different, and here is why:

If you’re trying to design a complex SoC,… Read More


Use Existing High Speed Interfaces for Silicon Test

Use Existing High Speed Interfaces for Silicon Test
by Tom Simon on 03-14-2022 at 6:00 am

High Speed Test Access

The growth of complexity for silicon test as it relates to test data volume and test times is driven by multiple concurrent factors. One dimension is simply the increase in silicon complexity. However, other factors are playing a role as well. These include higher reliability requirements for new applications such as automotive,… Read More


Getting to Faster Closure through AI/ML, DVCon Keynote

Getting to Faster Closure through AI/ML, DVCon Keynote
by Bernard Murphy on 03-10-2022 at 10:00 am

Manish min

Manish Pandey, VP R&D and Fellow at Synopsys, gave the keynote this year. His thesis is that given the relentless growth of system complexity, now amplified by multi-chiplet systems, we must move the verification efficiency needle significantly. In this world we need more than incremental advances in performance. We need… Read More


Non Volatile Memory IP is Invaluable for PMICs

Non Volatile Memory IP is Invaluable for PMICs
by Tom Simon on 03-07-2022 at 6:00 am

Applications for NVM in PMICs

Power Management ICs are a vitally important part of system design. Evidence of this is cited by a Synopsys white paper that mentions how Apple acquired a portion of PMIC developer Dialog Semiconductor that was previously their exclusive PMIC supplier. Clearly Apple had decided that PMIC design was a strategic differentiating… Read More


Why It’s Critical to Design in Security Early to Protect Automotive Systems from Hackers

Why It’s Critical to Design in Security Early to Protect Automotive Systems from Hackers
by Mike Borza on 02-03-2022 at 6:00 am

Figure 2 Automotive Security Diagram

Remember when a pair of ethical hackers remotely took over a Jeep Cherokee as it was being driven on a highway near downtown St. Louis back in 2015? The back story is, those “hackers,” security researchers Charlie Miller and Chris Valasek, approached vehicle manufacturers several years before their high-profile feat, warning… Read More


Upcoming Webinar: 3DIC Design from Concept to Silicon

Upcoming Webinar: 3DIC Design from Concept to Silicon
by Kalar Rajendiran on 01-26-2022 at 10:00 am

Lessons from Existing Multi Die Solutions

Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression.  Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More


Identity and Data Encryption for PCIe and CXL Security

Identity and Data Encryption for PCIe and CXL Security
by Tom Simon on 01-07-2022 at 6:00 am

Security for Cloud Applications

Privacy and security have always been a concern when it comes to computing. In prior decades for most people this meant protecting passwords and locking your computer. However, today more and more users are storing sensitive data in the cloud, where it needs to be protected at rest and while in motion. In a Synopsys webinar Dana Neustadter,… Read More


Heterogeneous Integration – A Cost Analysis

Heterogeneous Integration – A Cost Analysis
by Tom Dillinger on 12-29-2021 at 10:00 am

cost comparison

Heterogeneous integration (HI) is a general term used to represent the diverse possibilities for die technology incorporated into advanced 2.5D/3D packaging.  At the recent International Electron Devices Meeting (IEDM) in San Francisco, a team from Synopsys and IC Knowledge presented data from analyses of future potential… Read More


Delivering Systemic Innovation to Power the Era of SysMoore

Delivering Systemic Innovation to Power the Era of SysMoore
by Kalar Rajendiran on 12-28-2021 at 6:00 am

Evolving Landscape

With the slowing down of Moore’s law , the industry as a whole has been working on various ways to maintain the rate of growth and advancements. A lot has been written up about various solutions being pursued to address specific aspects. The current era is being referred to by different names, SysMoore being one that Synopsys uses.… Read More


Creative Applications of Formal at Intel

Creative Applications of Formal at Intel
by Bernard Murphy on 12-01-2021 at 6:00 am

formal image min

One of the sessions I enjoyed at the Synopsys Verification Day 2021 was a presentation on applying formal to a couple of non-traditional problem domains. I like talks of this kind because formal can sometimes be boxed into a limited set of applications, under-exploiting the potential of the technology. Intel have built a centralized… Read More