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IEDM was buzzing with many presentations about the newest gate-all-around transistor. Both Intel and TSMC announced processes based on nanosheet technology. This significant process innovation allows the fabrication of silicon RibbonFET CMOS devices, which promise to open a new era of transistor scaling, keeping Moore’s… Read More
There was a lot of discussion at IEDM about the coming shift to gate-all-around (GAA) transistor structures. This new device brings many benefits to continue device scaling, both at the monolithic device level as well as for multi-die design. The path to GAA is not simple, there are new material, process and design considerations… Read More
A response to Daniel Nenni’s “What’s Wrong with Intel?” article, which invited alternative views.
At the risk of calling down the forecast universal opprobrium, I’m going to disagree with Dan’s take on the centrality of Intel.
I don’t agree that Intel is too big/important to fail or that the US can’t succeed in semiconductors without… Read More
IEDM turned 70 last week. This was cause for much celebration in the form of special events. One such event was a special invited paper on Tuesday afternoon from Intel’s Tahir Ghani, or Mr. Transistor as he is known. Tahir has been driving innovation at Intel for a very long time. He is an eyewitness to the incredible impact of the Moore’s… Read More
The main program for the 70th IEDM opened on Monday morning in San Francisco with an excellent keynote from Dr. Yuh-Jier Mii, Executive Vice President and Co-Chief Operating Officer at TSMC. Dr. Mii joined TSMC in 1994. Since then, he has contributed to the development and manufacturing of advanced CMOS technologies in both fab
One of the most popular topics on the SemiWiki forum is Intel, which I understand. Many of us grew up with Intel, some of us have worked there, and I can say that the vast majority of us want Intel to succeed. The latest Intel PR debacle is the abrupt departure of CEO Pat Gelsinger. To me this confirms the answer to the question, “What is … Read More
Dan is joined by Dr. Tahir Ghani, Intel senior fellow and director of process pathfinding in Intel’s Technology Research Group. Tahir has a 30-year career at Intel working on many innovations, including strained silicon, high-K metal gate devices, FinFETs, RibbonFETs, and backside power delivery (BSPD), among others. He has… Read More
WIth packaging being one of the top sources of traffic on SemiWiki, I am expecting a big crowd at this event. A semiconductor substrate is a foundational material used in the fabrication of semiconductor devices. Substrates are a critical part of the manufacturing process and directly affect the performance, reliability, and… Read More
Dan is joined by Dr. Emre Ozer, Senior Director of Processor Development at Pragmatic Semiconductor. With 67 worldwide patents, and over 60 peer-reviewed publications to his name, he has extensive experience in CPU microarchitecture with particular expertise in performance modelling, fault tolerant CPUs, embedded machine… Read More
The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More
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Protect against ESD by ensuring latch-up guard rings