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The evolution of low-cost heterogeneous multi-chip packaging (MCP) has led to significant system-level product innovations. Three classes of MCP offerings have emerged:
TSMC recently announced plans to spend $100 billion dollars over three years on capital. For 2021 they announced $30B in total capital with 80% on advanced nodes (7nm and smaller), 10% on packaging and masks and 10% on “specialty”.
If we take a guess at the capital for each year, we can project something like $30B for 2021 (announced),… Read More
We were all pleasantly surprised when TSMC increased 2021 Capex to a record $28 billion. To me this validated the talk inside the ecosystem that Intel would be coming to TSMC at 3nm. We were again surprised when TSMC announced a $100B investment over the next three years which belittled Intel’s announcement that they would spend … Read More
– Intel announced 2 new fabs & New Foundry Services
– Not only do they want to catch TSMC they want to beat them
– It’s a very, very tall order for a company that hasn’t executed
– It will require more than a makeover to get to IDM 2.0
Intel not only wants to catch TSMC but beat them at their own … Read More
Intel made a big splash on March 23, 2021 by doubling down on manufacturing with the creation of Intel Foundry Services (IFS). The big announcement was supported by potential customers such as Qualcomm, Cisco, Ericsson, Google, Amazon, Microsoft, and IBM. With an accompanying $20B investment, the EDA and equipment industries,… Read More
In January I presented at the ISS conference a comparison of Intel’s, Samsung’s and TSMC’s leading edge offerings. You can read a write-up of my presentation here.
With the problems going on at Intel, that article generated a lot of interest in the investment community, and I have been holding a lot of calls with analysts who are trying… Read More
New Intel CEO Pat Gelsinger is not wasting any time in changing the course of the largest semiconductor company the world has ever seen. Today he announced the IDM 2.0 strategy which will better leverage Intel’s manufacturing abilities. There is a lot to talk about here but let’s focus on the new Intel Foundry Services because the… Read More
Dan takes an in-depth look at Intel with Stacy Rasgon, Managing Director and Senior Analyst, U.S. Semiconductors at Bernstein Research. Stacy is an unusual semiconductor analyst as he holds a Ph.D. in chemical engineering from MIT. His substantial technical knowledge allows for a deep dive on Intel that you will find refreshing… Read More
The term von Neumann bottleneck is used to denote the issue with the efficiency of the architecture that separates computational resources from data memory. The transfer of data from memory to the CPU contributes substantially to the latency, and dissipates a significant percentage of the overall energy associated with … Read More
Research pursuing in-memory computing architectures is extremely active. At the recent International Solid State Circuits conference (ISSCC 2021), multiple technical sessions were dedicated to novel memory array technologies to support the computational demand of machine learning algorithms.
The inefficiencies associated… Read More
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Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems