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Intel buys Tower – Best way to become foundry is to buy one

Intel buys Tower – Best way to become foundry is to buy one
by Robert Maire on 02-15-2022 at 10:00 am

Intel Tower Semiconductor Acquisition

-Intel jumpstarts foundry model with Tower semi buy @$54B Gets complementary tech to round out offerings
-Approval based on satisfying China’s needs as well
-Margin concerns overblown- Will it be allowed to flourish?

Intel pays up to get foundry and technology….

Intel announced a $5.4B acquisition of Tower Semiconductor… Read More


The Intel Foundry Ecosystem Explained

The Intel Foundry Ecosystem Explained
by Daniel Nenni on 02-15-2022 at 5:00 am

Intel Tower Semiconductor Acquisition

Exciting times for the semiconductor industry! Last week Intel announced a billion dollar fund to build a foundry ecosystem and today Intel announced they are acquiring foundry Tower Semiconductor for $5.6 billion dollars, WOW! Some people doubted Intel’s commitment to the foundry market this time. I think we can now put that… Read More


The Semiconductor Ecosystem Explained

The Semiconductor Ecosystem Explained
by Steve Blank on 02-06-2022 at 6:00 am

TSMC Ecosystem Explained

The last year has seen a ton written about the semiconductor industry: chip shortages, the CHIPS Act, our dependence on Taiwan and TSMC, China, etc.

But despite all this talk about chips and semiconductors, few understand how the industry is structured. I’ve found the best way to understand something complicated is to diagram… Read More


Samsung Keynote at IEDM

Samsung Keynote at IEDM
by Scotten Jones on 01-27-2022 at 6:00 am

Samsung Keynote Figure 1

Kinam Kim is a longtime Samsung technologist who has published many excellent articles over the years. He is now the Chairman of Samsung Electronics, and he gave a very interesting keynote address at IEDM.

He began with some general observations:

The world is experiencing a transformation powered by semiconductors that has been… Read More


ASML Too Much Demand Plus Intel and High NA

ASML Too Much Demand Plus Intel and High NA
by Robert Maire on 01-23-2022 at 6:00 am

ASML High NA Intel

Too much demand- A “good” problem-Managing supply & capacity-Intel & Hi NA

ASML great Q4 results-Demand off charts-Supply constrained
-Dealing with chain issues, putting out fires, expediting
-Looking forward to next gen High NA in 2024/2025
-Intel’s order doesn’t give advantage,… Read More


TSMC Earnings – The Handoff from Mobile to HPC

TSMC Earnings – The Handoff from Mobile to HPC
by Doug O'Laughlin on 01-20-2022 at 10:00 am

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Hello! The most important semiconductor company in the world reported earnings last night. It’s been something of a tradition to post Taiwan Semiconductor Company (TSMC) earnings posts not behind my paywall, and I think that I’m going to continue that to kickoff each earnings season.

There are so many threads in the TSMC call that… Read More


Forty Four Billion Reasons Why TSMC Remains Dominant

Forty Four Billion Reasons Why TSMC Remains Dominant
by Robert Maire on 01-20-2022 at 6:00 am

Forty Four Billion Reasons Why TSMC Remains Dominant

-Chips for America is better than nothing, but not much
TSMC $40-44B Capex crushes competition (Intel & Samsung)
-Additional efforts other than handouts are necessary
-Could/should TSMC be “adopted” as a US company?

Competition can’t keep up with $40-$44B of Capex

TSMC’s recent announcement… Read More


Self-Aligned Via Process Development for Beyond the 3nm Node

Self-Aligned Via Process Development for Beyond the 3nm Node
by Tom Dillinger on 01-05-2022 at 6:00 am

TEM DoD

The further scaling of interconnect and via lithography for advanced nodes is challenged by the requirement to provide a process window that supports post-patterning critical dimension variations and mask overlay tolerances.  At the recent international Electron Devices Meeting (IEDM) in San Francisco, TSMC presented … Read More


Technology Design Co-Optimization for STT-MRAM

Technology Design Co-Optimization for STT-MRAM
by Tom Dillinger on 01-04-2022 at 6:00 am

sense amplifier

Previous SemiWiki articles have described the evolution of embedded non-volatile memory (eNVM) IP from (charge-based) eFlash technology to alternative (resistive) bitcell devices.  (link, link)

The applications for eNVM are vast, and growing.  For example, microcontrollers (MCUs) integrate non-volatile memory for … Read More


Advanced 2.5D/3D Packaging Roadmap

Advanced 2.5D/3D Packaging Roadmap
by Tom Dillinger on 01-03-2022 at 6:00 am

SoIC futures

Frequent SemiWiki readers are no doubt familiar with the advances in packaging technology introduced over the past decade.  At the recent International Electron Devices Meeting (IEDM) in San Francisco, TSMC gave an insightful presentation sharing their vision for packaging roadmap goals and challenges, to address the growing… Read More