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Intel vs AMD Q4 2019 Conference Calls

Intel vs AMD Q4 2019 Conference Calls
by Daniel Nenni on 02-04-2020 at 6:00 am

Intel 10nm Roadmap

Now that the dust has settled and I’m out of cronovirus quarantine let’s talk about the Intel and AMD conference calls. Unfortunately, the Intel and AMD marketing teams are still outpacing engineering so it is difficult to write something serious but I will do my best.

Spoiler Alert: Both CEOs disappoint.

First an Intel 10nm update:… Read More


AI the Matrix and Intel

AI the Matrix and Intel
by Daniel Nenni on 12-23-2019 at 6:00 am

AI Matrix Intel

I would guess that most people have seen or at least heard of the Matrix movies but how many people can remember who vanquished the earth to begin the series? It was artificial intelligence (AI) of course which seemed pretty far fetched 20 years ago, but today not so much. In fact, for those of us in the AI know it seems quite likely in some… Read More


IEDM 2019 – TSMC 5nm Process

IEDM 2019 – TSMC 5nm Process
by Scotten Jones on 12-16-2019 at 10:00 am

IEDM is in my opinion the premiere conference for information on state-of-the-art semiconductor processes. In “My Top Three Reasons to Attend IEDM 2019” article I singled out the TSMC 5nm paper as a key reason to attend.

IEDM is one of the best organized conferences I attend and as soon as you pick up your badge you are handed a memory… Read More


Bob Swan says Intel 7nm equals TSMC 5nm!

Bob Swan says Intel 7nm equals TSMC 5nm!
by Daniel Nenni on 12-09-2019 at 6:00 am

Bob Swan is really starting to grow on me. Admittedly, I am generally not a fan of CFOs taking CEO roles at semiconductor companies but thus far Bob is doing a great job. This comes from my outside-looking-in observations and from the people I know inside Intel, absolutely.

Bob did a fireside chat with Credit Suisse at their 23rd annual… Read More


Why is Intel Still Short on Chips?

Why is Intel Still Short on Chips?
by Daniel Nenni on 12-03-2019 at 6:00 am

Intel is again apologizing to customers for 14nm chip shortages. As a result PC makers are revising down revenue expectations for 2020. Something does not smell right here. I have also read that due to the continued shortages Intel will be second sourcing CPU chips to Samsung 14nm. This smells even worse, absolutely.

First and foremost,… Read More


2020 Semiconductor Foundry Landscape Update!

2020 Semiconductor Foundry Landscape Update!
by Daniel Nenni on 11-15-2019 at 6:00 am

When I first started working with the foundries 25 years ago I would have never imagined that I would make a career out of it, which I most certainly have. Fortunately, I recognized early on that not only are the foundries the cornerstone of the semiconductor ecosystem, they are also a very important economic bellwether, absolutely.… Read More


Intel CEO Update Q4 2019

Intel CEO Update Q4 2019
by Daniel Nenni on 11-04-2019 at 6:00 am

Bob Swan started as interim CEO in June of 2018 and took the full-time CEO job in January of 2019. I was a vocal critic of the previous CEO Brian Krzanich (BK) and really felt he was not fit to serve. As it turns out I was right. It is not just the CEO himself, but also the people that he surrounds himself with. BK surrounded himself with the… Read More


AMD Intel TSMC menage a trois and the trouble with trouples

AMD Intel TSMC menage a trois and the trouble with trouples
by Robert Maire on 11-01-2019 at 10:00 am

  • Its “Complicated”- A 3 way Chip Relationship
  • Competing for Wafers, Moore’s Law & Love
  • Who’s Competing with Whom?
  • All’s Fair

The 3 way relationship is more complex than it seems

On the surface it seems simple. AMD and TSMC compete with Intel making its own chips and TSMC making them for AMD. But… Read More


My Top Three Reasons to Attend IEDM 2019

My Top Three Reasons to Attend IEDM 2019
by Scotten Jones on 10-11-2019 at 6:10 am

The International Electron Devices Meeting is a premier event to learn about the latest in semiconductor process technology. Held every year in early December is San Francisco this years conference will be held  from Decembers 7th through December 11th. You can learn more about the conference at their web site here.

This is a must… Read More


The Coming Tsunami in Multi-chip Packaging

The Coming Tsunami in Multi-chip Packaging
by Tom Dillinger on 07-12-2019 at 6:00 am

The pace of Moore’s Law scaling for monolithic integrated circuit density has abated, due to a combination of fundamental technical challenges and financial considerations.  Yet, from an architectural perspective, the diversity in end product requirements continues to grow.  New heterogeneous processing units are being… Read More