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At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.
EUV is ramping up into high volume 7nm… Read More
Last week I attended the 2019 SPIE Advanced Lithography Conference. I gave two presentations, attended dozens of papers and conducted three interviews. I will be doing some detailed write ups particularly on EUV but I am waiting for the presentations from several of the papers. In the mean time I thought I would put some overall … Read More
I was asked to present at Nikon’s LithoVision event again this year. LithoVision is held the day before the SPIE Advanced Lithography Conference also in San Jose. The following is a write up of my talk.… Read More
Not as much new – No breakthrough announcements, 300 watts is better than 250 watts – Pellicle Problems, TSMC is EUV king – Third times a charm? We attended this years SPIE Lithography convention in San Jose as we have for many years. Although the show was quite enthusiastic and EUV was the central topic, as it has… Read More
Strong Overall Market Growth but a Slowdown Looms
After six years of single digit percentage growth in the overall semiconductor market, 2017 saw almost 22% growth and 2018 year-to-date is up roughly 17% (based on numbers published by the world semiconductor trade statistics). The big growth driver the last two years has been … Read More
At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More
At IEDM last week Anthony (Tony) Yen, Vice President and Head, Technology Development Centers Worldwide for ASML presented a paper entitled “EUV Lithography at Threshold of High-Volume Manufacturing” authored by Anthony Yen, Hans Meiling, and Jos Benschop. At IEDM I had a chance to sit down with Tony and discuss the paper and … Read More
At SEMICON West I attended the imec technology forum, multiple Tech Spot presentations and conducted a number of interviews relevant to advanced lithography and EUV. In this article I will summarize what I learned plus make some comments on the outlook for EUV.… Read More
KLAC put up a great quarter coming in at revenues of $1.07B and EPS of $2.22. Guidance is for $1.03B to $1.1B with EPS of $2 to $2.32. Both reported and guided were at the high end of the range and above consensus. We had suggested in our preview notes that KLAC would be the least impacted of the big three (AMAT, LRCX & KLAC) semi equipment… Read More
ASML put up good results with revenues of Euro2.285B versus street of Euro2.22B and EPS of Euro1.26 versus street of Euro1.17. Guide is for Euro2.55B versus street of Euro2.46B but EPS of Euro1.16 versus street EPS of Euro1.35 on lower gross margins, slipping from 48% to 43%.
A couple of EUV systems have slipped out. This is not surprising… Read More
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CHIPS Act dies because employees are fired – NIST CHIPS people are probationary