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At IEDM this December Imec presented “Interconnect metals beyond copper – reliability challenges and opportunities”. In addition to seeing the paper presented I had a chance to interview one of the authors, Kristof Croes. Replacements for copper are a hot subject and I will summarize the challenges and Imec’s work.… Read More
At IEDM last week Anthony (Tony) Yen, Vice President and Head, Technology Development Centers Worldwide for ASML presented a paper entitled “EUV Lithography at Threshold of High-Volume Manufacturing” authored by Anthony Yen, Hans Meiling, and Jos Benschop. At IEDM I had a chance to sit down with Tony and discuss the paper and … Read More
At SEMICON West I attended the imec technology forum, multiple Tech Spot presentations and conducted a number of interviews relevant to advanced lithography and EUV. In this article I will summarize what I learned plus make some comments on the outlook for EUV.… Read More
KLAC put up a great quarter coming in at revenues of $1.07B and EPS of $2.22. Guidance is for $1.03B to $1.1B with EPS of $2 to $2.32. Both reported and guided were at the high end of the range and above consensus. We had suggested in our preview notes that KLAC would be the least impacted of the big three (AMAT, LRCX & KLAC) semi equipment… Read More
ASML put up good results with revenues of Euro2.285B versus street of Euro2.22B and EPS of Euro1.26 versus street of Euro1.17. Guide is for Euro2.55B versus street of Euro2.46B but EPS of Euro1.16 versus street EPS of Euro1.35 on lower gross margins, slipping from 48% to 43%.
A couple of EUV systems have slipped out. This is not surprising… Read More
There is a report in the Seoul Economic Daily that Samsung has completed development of their 7nm process using EUV and that production will begin in June. What is claimed in the report is:
I was invited to give a talk at the Business of Cleans Conference held by Linx Consulting in Boston on April 9th. I am not a cleans expert but rather was invited more to give an overview talk on process technology trends and the impact on cleans. In this write up I will discuss my presentation. I discussed each of the three main leading-edge… Read More
At the SPIE Advanced Lithography Conference in February ASML gave an update on their EUV systems, in this blog I will provide a summary of what they presented. I have also written about my impressions on EUV for the overall conference here.… Read More
This year the Advanced Lithography Conference felt very different to me than the last couple of years. I think it was Chris Mack who proclaimed it the year of Stochastics. EUV has dominated the conference for the last several years but in the past the conversation has been mostly centered on the systems, system power and uptime.
I … Read More
I was invited to present at Nikon’s LithoVision event held the day before the SPIE Advanced Lithography Conference in San Jose. The following is a write up of the talk I gave. In this talk I discuss the three main segments in the semiconductor industry, NAND, DRAM and Logic and how technology transitions will affect lithography.… Read More
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