Mixel, Inc., a leading provider of mixed-signal interface IP, will exhibit at booth #2616 at Design Automation Conference (DAC) 2025 on June 23-25. The company will demonstrate its latest customer demos featuring Mixel’s MIPI PHY IP and LVDS IP. Mixel’s customers include many of the world’s largest semiconductors and system… Read More
Semiconductor Intellectual Property
Analog Bits at the 2025 Design Automation Conference #62DAC
Analog Bits attends a lot of events. I know because I see them a lot in my travels. Lately, the company has been stealing the show with cutting-edge analog IP on a broad range of popular nodes and a strategy that will change the way design is done. Analog Bits is quietly rolling out a new approach to system design. One that delivers a holistic… Read More
Arm Reveals Zena Automotive Compute Subsystem
Last year Arm announced their support for standards-based virtual prototyping in automotive, along with a portfolio of new AE (automotive enhanced) cores. They also suggested that in 2025 they would be following Arm directions in other LOBs by offering integrated compute subsystems (CSS). Now they have delivered: their Zena… Read More
Relaxation-Aware Programming in ReRAM: Evaluating and Optimizing Write Termination
Resistive RAM (ReRAM or RRAM) is the strongest candidate for next-generation non-volatile memory (NVM), combining fast switching speeds with low power consumption. New techniques for managing a memory phenomenon called ‘relaxation’ are making ReRAM more predictable — and easier to specify for real-world applications.… Read More
Breker Verification Systems at the 2025 Design Automation Conference #62DAC
Breker Verification Systems Plans Demonstrations of its Complete Synthesis and SystemVIP Library and Solutions Portfolio
Attendees who step into the Breker Verification Systems booth during DAC (Booth #2520—second floor) will see demonstrations of its Trek Test Suite Synthesis and SystemVIP libraries and solutions portfolio.… Read More
Synopsys Addresses the Test Barrier for Heterogeneous Integration
The trend is clear, AI and HPC is moving to chiplet-based, or heterogenous design to achieve the highest levels of performance, while traditional monolithic system-on-chip (SoC) designs struggle to scale. What is also clear is the road to this new design style is not a smooth one. There are many challenges to overcome. Some are … Read More
Anirudh Keynote at CadenceLIVE 2025 Reveals Millennium M2000
Another content-rich kickoff covering a lot of bases under three main themes: the new Millennium AI supercomputer release, a moonshot towards full autonomy in chip design exploiting agentic AI, and a growing emphasis on digital twins. Cadence President and CEO Anirudh Devgan touched on what is new today, and also market directions… Read More
Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More
WEBINAR: PCIe 7.0? Understanding Why Now Is the Time to Transition
PCIe is familiar to legions of PC users as a high-performance enabler for expansion slots, especially GPU-based graphics cards and M.2 SSDs. It connects higher-bandwidth networking adapters and niche applications like system expansion chassis in server environments. Each PCIe specification generation has provided a leap… Read More
Andes Technology: Powering the Full Spectrum – from Embedded Control to AI and Beyond
As the computing industry seeks more flexible, scalable, and open hardware architectures, RISC-V has emerged as a compelling alternative to proprietary instruction set architectures. At the forefront of this revolution stands Andes Technology, offering a comprehensive lineup of RISC-V processor solutions that go far beyond… Read More
EUV Resist Degradation with Outgassing at Higher Doses