It’s well known that flash is the embedded non-volatile memory (NVM) incumbent technology. As with many technologies, flash is bumping into limits such as power consumption, speed, endurance and cost. It is also not scalable below 28nm. This presents problems for applications such as AI inference engines that require embedded… Read More
Semiconductor Intellectual Property
Podcast EP241: A Look at Agile Analog IP with Chris Morrison
Dan is joined by Chris Morrison, who has over 15 years of experience in delivering innovative analog, digital, power management and audio solutions for International electronics companies, and developing strong relationships with key partners across the semiconductor industry. Currently he is the Director of Product Marketing… Read More
Emerging Memories Overview
This year’s Future of Memory and Storage Conference (formerly the Flash Memory Summit) was again very well attended. The Santa Clara Convention Center is definitely the place to be for a Silicon Valley Conference.
This post is about the Emerging Memories session organized by Dave Eggleston. We will be covering other sessions… Read More
The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More
First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity
Increased processing and connectivity in automobiles are cranking up the priority for advanced cybersecurity steps to keep roads safe. Electronic vehicle interfaces, including 5G/6G, Bluetooth, Wi-Fi, GPS, USB, CAN, and others, offer convenience features for drivers and passengers, but open numerous attack vectors for… Read More
PieceMakers HBLL RAM: The Future of AI DRAM
PieceMakers, a fabless DRAM product company, is making waves in the AI industry with the introduction of a new DRAM family that promises to outperform traditional High Bandwidth Memory (HBM). The launch event featured industry experts, including a representative from Samsung, highlighting the significance of this innovation.… Read More
Mitigating AI Data Bottlenecks with PCIe 7.0
During a recent LinkedIn webcast, Dr. Ian Cutress, Chief Analyst at More than Moore and Host at TechTechPotato, and Priyank Shukla, Principal Product Manager at Synopsys, shared their thoughts regarding the industry drivers, design considerations, and critical advancements in compute interconnects enabling data center… Read More
Custom Processor Design with Verification: Insights from Codasip at DAC
At the 62nd Design Automation Conference (DAC) on July 22, 2024, Philip Bena from Codasip delivered a compelling session on processor customization, emphasizing a responsible approach that prioritizes verification. Codasip, a European company with a global presence, offers a unique combination of RISC-V processor IP and… Read More
CAST, a Small Company with a Large Impact on Many Growth Markets #61DAC
Semiconductor IP has continued to grow as a market, and it was clearly a star performer at #61DAC. We all know the large suppliers of IP for semiconductors, but the market is actually quite diverse, with many players supporting many applications. I had a chance to meet with two executives from CAST, a company with a remarkably … Read More
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure
In the rapidly evolving landscape of high-performance computing (HPC) and artificial intelligence (AI), the demand for increased processing power, efficiency, and scalability is ever-growing. Traditional monolithic chip designs are increasingly unable to keep pace with these demands, leading to the emergence of chiplets… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?