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The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
New MIPI protocols: Unipro, LLI and CSI3 over MPHY.
Gabriele ZARRI, Moshik RUBIN, Cadence
Sophia Antipolis, France SAME 2012 Conference – October 2 & 3, 2012 2
Abstract:
With more than 50% of the world‟s population using cellular phones and the growing number of devices that go mobile, from game consoles and media player… Read More
SAME conference has started with Joel Huloux, Chairman of the MIPI Alliance, who gave a high level introduction about MIPI, rather business than technology oriented, talking to Marketing/Management audience. Extracting the main points from his presentation:
- More than 30 specifications have been issued (Important remark:
…
Read More
Learn everything you need to know about processors for enterprise- and carrier-communications systems. We have added more Speakers and industry experts and expanded the two-day conference program with 25 % more sessions.
We will be featuring presentations on the newest processors with multiple cores, programmable data planes,… Read More
Clearly the key to success in the foundry business is partnerships. Easy to say, harder to do, here is an excellent example of one that works: GLOBALFOUNDRIES and ARM announced in August 2012 a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer… Read More
Time flies! IEDM time is coming up again (this year on the left coast) and the conference program is now on-line. Lots of interest to the ReRAM/CBRAM community. While some trends are emerging (Hafnium Oxide appears to be the material of choice) there are still plenty of other more contentious issues. ReRAM/CBRAM has reached the … Read More
With an estimated 7 billion connected devices, the demand for rich content, including video, games, and mobile apps is skyrocketing. Service providers around the globe are scrambling to transform their networks to satisfy the overwhelming demand for content bandwidth. Over the next few years, they will be looking to network… Read More
Toshiba’s ReRAM R&D Roadmapby Ed McKernan on 09-30-2012 at 11:00 pmCategories: IP
Most companies in the memory business have ReRAM on their radar if not their roadmaps. Toshiba have made some bullish comments about the roadmap and chip size for ReRAM at a recent R&D Strategies Update. At face value, the schedule would put Toshiba quite a bit ahead of their competitors. Over at ReRAM-Forum.com, we have done… Read More
For all the raving and ranting and hand-wringing about the iPhone 5, the centerpiece of the device – the new A6 SoC – is proving to be a marvelous piece of engineering.… Read More
These last days have been full of Apple related stories; maybe it’s time to discuss a new topic? Like for example Samsung, direct competitor for Apple in the smartphone market, and take a look at the company move toward more vertical integration. Everybody working in the SC industry knows that Samsung is ranked #2 behind Intel, even… Read More
TSMC Unveils the World’s Most Advanced Logic Technology at IEDM