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Collaboration at 28nm, 20nm and 14nm

Collaboration at 28nm, 20nm and 14nm
by Daniel Payne on 06-06-2012 at 11:23 am

Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.

The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More

Jasper at DAC: ARM, Broadcom, Nvidia, ST

Jasper at DAC: ARM, Broadcom, Nvidia, ST
by Paul McLellan on 05-28-2012 at 7:01 pm

At DAC (next week, in case you have been under a rock for the last few months) Jasper has four of their customers presenting. Of course they are also presenting themselves making a total of 5 seminars.

nVidia is presenting on Sequential Equivalency Checking for Power Optimization with JasperGold Apps. It is on Monday at 11am, Tuesday… Read More

Network on Chip in Automotive: Arteris

Network on Chip in Automotive: Arteris
by Eric Esteve on 05-24-2012 at 9:20 am

The recent announcement from Arteris that iC-Logic chose FlexNoC and C2C to create a flexible and high speed communication chip to respond to the increasing demand of high speed connectivity in car infotainment systems is very interesting, as it shows that SoC designed for the Automotive market segment also require advanced … Read More

Software-based Wi-Fi: DSP IP core

Software-based Wi-Fi: DSP IP core
by Eric Esteve on 05-23-2012 at 10:05 am

The recent announcement from CEVA that it has joined the Wi-Fi Alliance® to further advocate for a software-based Wi-Fi® strategy shows that the new CEVA-XC4000 DSP can be used in various communication protocols, not limited to the traditional baseband processing for the wireless handset phone, where DSP IP core usage is massive.… Read More

Semiconductor Ecosystem Keynotes: ARM 2012

Semiconductor Ecosystem Keynotes: ARM 2012
by Daniel Nenni on 05-17-2012 at 5:00 pm

Yesterday’s SEMICO IP Ecosystem Conference was well worth the time. Everybody was there: ARM, Synopsys, Cadence, Mentor Graphics, GlobalFoundries, TSMC, MIPS, Tensilica, AMD, Atrenta, Sonics, and Tabula, everybody except Intel of course. What do Intel and I have in common? We don’t play well with others…

First up was… Read More

Smart mobile SoCs: Intel

Smart mobile SoCs: Intel
by Don Dingee on 05-16-2012 at 3:59 pm

Talk about an unusual position. Intel finds themselves very much currently outside when it comes to mobile SoCs for phones and tablets. After several attempts at soul-searching and a true understanding of the term “low-power” (not meaning 3W, but instead < 1W), they finally have a part – in the form of “Medfield”, aka the Atom… Read More

CEVA is the undisputed DSP worldwide leader

CEVA is the undisputed DSP worldwide leader
by Eric Esteve on 05-16-2012 at 10:54 am

Anybody working in the wireless handset segment probably knows that CEVA is the provider of DSP IP cores, and if you are simply a wireless handset user, you should know that the baseband digital signal processing is the function allowing your phone to process the RF (analog) signal coming from the outside world. If you have been involved… Read More

Analyzing Cortex Performance

Analyzing Cortex Performance
by Paul McLellan on 05-16-2012 at 7:45 am

CPAK sounds like something politicians create to collect money, but in fact it is a Carbon Performance Analysis Kit. It consists of models, reference platform, initialization software (for bare metal CPAKs) or OS binary (for Linux and Android based CPAKs). They are (or will soon be) available for ARM Cortex A9, ARM Cortex A15 and… Read More

MIPS, ARM, ARC, Imagination, Ceva

MIPS, ARM, ARC, Imagination, Ceva
by Paul McLellan on 05-15-2012 at 4:59 pm

The Linley Group, whose conference on mobile I recently attended, has some interesting data about the processor core market. Firstly, the numbers are big: CPU cores shipped in over 10 billion chips last year which is up 25% on last. ARM has a share of 78% of that entire market. The big surprise to me was the #2 was not MIPS but Synopsys… Read More