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Semiconductor Intellectual Property
Why making the difference between chips and cores, when mentioning that CEVA’s customers have shipped four billion IC to date? Because that can make a big difference! Imagine for example an IP vendor selling processor IP cores to be used in massively parallel computing application, when the chip maker create a processor NxM matrix,… Read More
The 2nd International Workshop on Resistive RAM. The workshop was the second installment of an annual series organized by Stanford University and the Belgian research institute Imec. Like most RRAM workshops, this year’s event featured talks focusing on the physics of RRAM devices and their underlying switching mechanism(s).… Read More
Introducing the first ReRAM-Forum movie!! In part 2 of their recently published papers in the Transactions on Electron Devices of the IEEE, Professor Ielmini’s group describe the modeling of resistive switching in bipolar metal oxide ReRAM. Like part 1, the paper is collaboration with David Gilmer of Sematech who provided the… Read More
At the annual Linley Processor Conference this past week a number of chip vendors proposed a raft of new networking solutions directed at solving today’s bandwidth issues. Perhaps the overall highlight of the conference was the recognition by Keynote Speaker Linley Gwennap of the shift that is taking place towards ARM based solutions.… Read More
Network on Chip (NoC) technology is probably one of the most fascinating new concepts that has been developed and is implemented in real chips. NoC can be integrated into various System on Chip (SOC), targeting several market segment: Video Processing, Consumer Electronics, Automotive, Networking, Multimedia (digital TV),… Read More
I was at the Linley Processor Conference yesterday. There are two of these each year, one focused on mobile and this one, focused on networking and communications (so routers, base-stations and the like). You probably know that ARM is pretty dominant in mobile handsets (and Intel is trying to get a toe-hold although I’m skeptical… Read More
The recent (August) flash memory summit in Santa Clara had a session devoted to ReRAM as well as featuring prominently in the keynote address by Sung Wook Park of SK Hynix. The talk includes a summary of NAND’s well known scaling issues along with approaches to 3D NAND. It turns out that they are working on three different technologies:… Read More
In a discussion with one of my PR network recently, I found myself thinking out loud that if the merchant SoC market is getting squeezed hard, that validates something I’ve been thinking – the merchant CPU board market is dying from the middle out.… Read More
Confused by the way a ReRAM cell behaves? Looking for a clear definition of the various terms used? Then check out Blogs at ReRAM-Forum.com. on recent publications appearing in the IEEE journals. The latest Blog discusses a paper published by Professor Daniele Ielmini of the Politecnico di Milano in Italy on the Resistive Switching… Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
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Has ASML Reached the Great Wall of China