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Semiconductor Intellectual Property
John Heinleinfrom ARM briefed me at DAC exactly one week ago. I love to use my mobile devices (MacBook Pro, iPad and Samsung Galaxy Note II) every day, and many mobile devices are ARM-powered because of the low power consumption, and pervasive eco-system around the architecture. Apple with the MacBook Pro is still Intel-powered,… Read More
If you have attended DAC in Austin (June 2-5), you probably have missed the first TSMC Technology Symposium. It was held on June 6 in Shanghai. Considering my own experience of a 29 hours trip to come back home (in France), I doubt that it was any possible to leave Austin on June 5 to attend TSMC Technology Symposium in Shanghai on June… Read More
ARM announced several new products at DAC in a number of different spaces. In addition I got invited to a briefing with Simon Segars, 30 days from when he takes over as CEO of ARM. I asked Simon if he expected to make any major changes and he basically said ‘no’. ARM’s basic strategy in both mobile and now enterprise… Read More
It has been a little over a fortnight since Paul Otellini officially stepped down from the CEO post and yet it seems to be more than a long time gone. Unlike his predecessors, he was not asked to remain on the board and perhaps it is a sign that his complete disengagement from the company was necessary to complete a future strategic engagement.… Read More
The 2013 Design Automation Conference celebrates its 50th anniversary Sunday, June 2 through Thursday, June 6 at the Austin Convention Center. DAC is the world’s leading technical conference and trade show on electronic design and design automation. DAC is where the IC Design and EDA ecosystem learns, networks, and does… Read More
Just in time for DAC, Carbon have announced that they have expanded their partnership with ARM to create and deliver models for the ARM Cortex-A57 processor and related IP. One piece of related IP is the Cortex-A53 which can be configured in big.LITTLE multi-core setups to achieve the sweet spot of higher performance and lower power.… Read More
Last year at DACI discovered a physical IP company called DXCorrthat competed against giant ARM. This year the company has selected a different direction, so I got caught up with Nirmalya Ghosh, the CEO to hear about the changes.
Nirmalya Ghosh, DXCorr
… Read More
In 2002 few people outside of Steve Jobs, could have predicted the iPhone. But a forward-looking technology CEO could expect Moore’s Law to extend into portable devices as it did with PCs. While 2G and 2.5G cellular phones were shipping in the hundreds of millions, the features were rather primitive. 3G, 4G, WiFi, Bluetooth,… Read More
I have mentioned NoC adoption explosion during the last two years, illustrated by the huge revenue growth of Arteris. This trend is now confirmed in the fastest moving segments, the Application Processors (AP) and LTE Modem for mobile applications. In fact, Arteris FlexNoC has been integrated in the majority of AP and LTE Modem… Read More
PCI Express 3.0 specification is 1000 pages long. Most of us, and most of the designers integrating PCIe gen-3 into their latest ASIC, FPGA or system will probably never read it completely, or even open it. In fact, they don’t need to read it completely, but they should care about one point, whether they buy an ASSP or a PCIe design IP:… Read More
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Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys