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TSMC OIP Ecosystem Forum 2012

TSMC OIP Ecosystem Forum 2012
by Daniel Nenni on 10-07-2012 at 7:11 pm

The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.


More than 90% of the attendees last year said “this… Read More


New MIPI protocols: Unipro, LLI and CSI3 over MPHY.

New MIPI protocols: Unipro, LLI and CSI3 over MPHY.
by Eric Esteve on 10-04-2012 at 8:10 am

New MIPI protocols: Unipro, LLI and CSI3 over MPHY.

Gabriele ZARRI, Moshik RUBIN, Cadence
Sophia Antipolis, France SAME 2012 Conference – October 2 & 3, 2012 2

Abstract:

With more than 50% of the world‟s population using cellular phones and the growing number of devices that go mobile, from game consoles and media player… Read More


So British! with Mike MULLER (ARM CTO & Founder) at SAME Conference

So British! with Mike MULLER (ARM CTO & Founder) at SAME Conference
by Eric Esteve on 10-04-2012 at 5:36 am

SAME conference has started with Joel Huloux, Chairman of the MIPI Alliance, who gave a high level introduction about MIPI, rather business than technology oriented, talking to Marketing/Management audience. Extracting the main points from his presentation:

  • More than 30 specifications have been issued (Important remark:
Read More

Linley Tech Processor Conference 2012

Linley Tech Processor Conference 2012
by Daniel Nenni on 10-03-2012 at 7:46 am


Learn everything you need to know about processors for enterprise- and carrier-communications systems. We have added more Speakers and industry experts and expanded the two-day conference program with 25 % more sessions.

We will be featuring presentations on the newest processors with multiple cores, programmable data planes,… Read More


GLOBALFOUNDRIES and ARM!

GLOBALFOUNDRIES and ARM!
by Daniel Nenni on 10-02-2012 at 8:30 pm


Clearly the key to success in the foundry business is partnerships. Easy to say, harder to do, here is an excellent example of one that works: GLOBALFOUNDRIES and ARM announced in August 2012 a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer… Read More


ReRAM/CBRAM at the 2012 IEDM Conference

ReRAM/CBRAM at the 2012 IEDM Conference
by Ed McKernan on 10-02-2012 at 8:10 pm


Time flies! IEDM time is coming up again (this year on the left coast) and the conference program is now on-line. Lots of interest to the ReRAM/CBRAM community. While some trends are emerging (Hafnium Oxide appears to be the material of choice) there are still plenty of other more contentious issues. ReRAM/CBRAM has reached the … Read More


Current Embedded Memory Solutions Are Inadequate for 100G Ethernet

Current Embedded Memory Solutions Are Inadequate for 100G Ethernet
by Sundar Iyer on 10-01-2012 at 7:00 pm

With an estimated 7 billion connected devices, the demand for rich content, including video, games, and mobile apps is skyrocketing. Service providers around the globe are scrambling to transform their networks to satisfy the overwhelming demand for content bandwidth. Over the next few years, they will be looking to network… Read More


Toshiba’s ReRAM R&D Roadmap

Toshiba’s ReRAM R&D Roadmap
by Ed McKernan on 09-30-2012 at 11:00 pm

Most companies in the memory business have ReRAM on their radar if not their roadmaps. Toshiba have made some bullish comments about the roadmap and chip size for ReRAM at a recent R&D Strategies Update. At face value, the schedule would put Toshiba quite a bit ahead of their competitors. Over at ReRAM-Forum.com, we have done… Read More


Samsung going vertical Qualcomm cry CEVA laugh

Samsung going vertical Qualcomm cry CEVA laugh
by Eric Esteve on 09-27-2012 at 11:09 am

These last days have been full of Apple related stories; maybe it’s time to discuss a new topic? Like for example Samsung, direct competitor for Apple in the smartphone market, and take a look at the company move toward more vertical integration. Everybody working in the SC industry knows that Samsung is ranked #2 behind Intel, even… Read More