800x100 Efficient and Robust Memory Verification (2)
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IP vendors enable SuperSpeed USB IP take off in 2012

IP vendors enable SuperSpeed USB IP take off in 2012
by Eric Esteve on 01-15-2013 at 5:09 am

SuperSpeed USB has been clearly ranked in the Interface protocols winner list, see this previous post. It could be interesting to dig into this IP market segment, determine in which applications USB 3.0 has been successfully deployed and who are the IP vendors serving this market, enabling SuperSpeed USB to take off.

SuperSpeed… Read More


Battling SoCs: QCOM vs NVDA vs Samsung

Battling SoCs: QCOM vs NVDA vs Samsung
by Daniel Nenni on 01-13-2013 at 7:00 pm

If I had to describe CES in one word it would be exhausting. There were 3,000+ vendors, 150,000+ people, lines for everything, but 100% pure excitement. Even my beautiful wife was intrigued by the technology that shapes our lives. The smart toaster was of great interest to her since she says I time my toast with the smoke alarm. The … Read More


A Brief History of Synopsys DesignWare ® IP

A Brief History of Synopsys DesignWare ® IP
by Daniel Nenni on 01-11-2013 at 9:00 am

Let’s play word association. I say “EDA”, you immediately think “Synopsys”. I say “IP” and although 15 years ago you may not, today, you think “Synopsys”. For nearly two decades, Synopsys has grown its IP business through both organic development and acquisition, with a clear focus on enabling designers to meet their time-to-market… Read More


OTP @ 2013 Common Platform Technology Forum

OTP @ 2013 Common Platform Technology Forum
by Daniel Nenni on 01-06-2013 at 9:00 pm

Sidense will be exhibiting at the Common Platform Technology Forum in Santa Clara, California on February 5, during which time they will be discussing their one-transistor, one-time programmable (1T-OTP) memory IP products. Based on their patented 1T-Fuse™ bit cell, Sidense antifuse-based 1T-OTP macros offer a secure, reliable,… Read More


Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes

Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes
by Daniel Nenni on 01-04-2013 at 7:00 pm

The Common Platform Alliance — IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES — continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. Join us at our 2013 Common Platform Technology Forumon Tuesday, February 5, 2013 at the Santa Clara Convention Center as we showcaseRead More


Audio/Voice DSP IP core: the next road to billion unit shipment

Audio/Voice DSP IP core: the next road to billion unit shipment
by Eric Esteve on 01-04-2013 at 6:09 am

When mentioning CEVA DSP IP cores, the first reaction is to think about the complexes DSP functions used into wireless Modem Application like 3G and Long Term Evolution (LTE). Considering that CEVA market share is above 70% for these products, such a reaction makes sense. But did you knew that CEVA DSP IP cores are also empowering… Read More


Formal Verification at ARM

Formal Verification at ARM
by Paul McLellan on 12-20-2012 at 4:34 pm

There are two primary microprocessor companies in the world these days: Intel and ARM. Of course there are many others but Intel is dominant on the PC desktop (including Macs) and ARM is dominant in mobile (including tablets).

One of the keynotes at last month’s Jasper User Group (JUG, not the greatest of acronyms) was by Bob… Read More


Cortex-A9 speed limits and PPA optimization

Cortex-A9 speed limits and PPA optimization
by Don Dingee on 12-19-2012 at 3:01 pm

We know by now that clock speeds aren’t everything when it comes to measuring the goodness of a processor. Performance has direct ties to pipeline and interconnect details, power factors into considerations of usability, and the unspoken terms of yield drive cost.

My curiosity kicked in when I looked at the recent press release… Read More


New HP Memristor Material Developments

New HP Memristor Material Developments
by Ed McKernan on 12-12-2012 at 10:00 pm

At the recent NCCAVS Thin Film Users Group meeting in November, HP was on the program in the person of Joshua Yang who gave a materials centric look at the status of the HP ReRAM (Memristor) program. A colleague passed on the informative set of slides presented at the meeting. Being a former process integration team leader, I was immediately… Read More