SILVACO 073125 Webinar 800x100
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New CEVA X baseband architecture takes on multi-RAT

New CEVA X baseband architecture takes on multi-RAT
by Don Dingee on 02-18-2016 at 4:00 pm

What we think of as a “baseband processor” for cellular networks is often comprised of multiple cores. Anecdotes suggest to handle the different signal processing requirements for 2G, 3G, and 4G networks, some SoC designs use three different DSPs plus a control processor such as an ARM core. That’s nuts. What is the point of having… Read More


Exploring USB Type-C DRP to USB Type-C DFP connection using USB C-Thru

Exploring USB Type-C DRP to USB Type-C DFP connection using USB C-Thru
by Rajaram Regupathy on 02-17-2016 at 12:00 pm

In a USB Type-C environment configuration process between a DRP and a DFP is as follows:

  • DRP to DFP attach/detach detection
  • Plug orientation detection
  • Initial DRP to DFP and power relationship detection
  • USB Type-C VBus current detection and usage
Read More

Reconfigurable redefined with embedded FPGA core IP

Reconfigurable redefined with embedded FPGA core IP
by Don Dingee on 02-12-2016 at 7:00 am

On November 1, 1985, before anyone had heard the phrase field programmable gate array, Xilinx introduced what they called a “new class of ASIC” – the XC2064, with a whopping 1200 gates. Reconfigurable computing was born and thrived around the RAM-based FPGA, whose logic and input/output pins could be architected into a variety… Read More


ARM POPs Another One!

ARM POPs Another One!
by Daniel Nenni on 02-11-2016 at 4:00 pm

ARM announced a new POP deal with UMC 28nm last week. POP stands for Processor Optimized Package meaning physical IP libraries (logic and memory) are customized for ARM processor cores and mainstream EDA tools creating a platform for optimized chip design. POP is a much bigger deal than most people realize so let’s get into a little… Read More


Low end LTE UE categories seeing more action

Low end LTE UE categories seeing more action
by Don Dingee on 02-08-2016 at 4:00 pm

Most of our attention goes toward the higher end of the LTE UE categories – ones designed for moving large amounts of multimedia data from smartphones and tablets concurrently with voice traffic. An equally interesting discussion is taking shape at the low end of the LTE UE categories targeting M2M and IoT devices with power-efficient,… Read More


IP Vendor Nabs Top Talent from Semiconductor Industry

IP Vendor Nabs Top Talent from Semiconductor Industry
by Tom Simon on 02-07-2016 at 4:00 pm

The growth of mobile and IoT have helped increase the demand for One Time Programmable Non Volatile Memory (OTP NVM) as a solution for on-chip storage. To continue to meet this demand and grow with it, industry leading Sidense has recently brought on board seasoned semiconductor executive Ken Wagner as VP of Engineering. He was … Read More


Submerging the Data Center

Submerging the Data Center
by Eric Esteve on 02-02-2016 at 4:00 pm

One of NetSpeed’s customers is a Tier-1 semiconductor company that develops some of the industry’s best performing and most complex system on chips (SoC) for the data center and cloud computing markets. To keep its leadership in the data center market, the company needs to produce best-in-class SoC solutions year after year. … Read More


True Random Number Generation

True Random Number Generation
by Bernard Murphy on 01-27-2016 at 4:00 pm

Random numbers are central to modern security systems. The humble password, perhaps the least profound application, is encrypted and verified against using SHA or MD algorithms with a random number salt. You probably remember a college class on how to generate pseudo-random numbers algorithmically, some very sophisticated.… Read More


Does IoT need Sensor Fusion? Yes, but at low-power, low cost…and higher performance

Does IoT need Sensor Fusion? Yes, but at low-power, low cost…and higher performance
by Eric Esteve on 01-27-2016 at 12:00 pm

We said this in the past, but let’s reiterate that IoT devices will be successful if they can meet low-cost and low-power requirements. Low-cost is the condition for IoT devices market penetration, I mean such a market adoption that we count several IoT systems (and dozens of devices) in every house. That’s the only way to reach the… Read More


Smart TV Chipset: 4 Key Takeaways from Interconnect IP

Smart TV Chipset: 4 Key Takeaways from Interconnect IP
by Majeed Ahmad on 01-26-2016 at 4:00 pm

The ultra high-definition (UHD) or 4K TV hardware is leading to insanely powerful chipsets in the age of Netflix, and that is taking the system-on-chip (SoC) design to a whole new level of complexity. Take the case of Samsung’s new chipset for SUHD TVs that boasts more than 100 IP interfaces.

Here, apart from the usual suspects… Read More