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Features of Resistive RAM Compute-in-Memory Macros

Features of Resistive RAM Compute-in-Memory Macros
by Tom Dillinger on 03-02-2021 at 8:00 am

V bitline

Resistive RAM (ReRAM) technology has emerged as an attractive alternative to embedded flash memory storage at advanced nodes.  Indeed, multiple foundries are offering ReRAM IP arrays at 40nm nodes, and below.

ReRAM has very attractive characteristics, with one significant limitation:

  • nonvolatile
  • long retention time
  • extremely
Read More

Webinar: Achronix and Vorago Deliver Innovation to Address Rad-Hard and Trusted SoC Design

Webinar: Achronix and Vorago Deliver Innovation to Address Rad-Hard and Trusted SoC Design
by Mike Gianfagna on 03-01-2021 at 10:00 am

Webinar Achronix and Vorago Deliver Innovation to Address Rad Hard and Trusted SoC Design FINAL

Radiation hardening is admittedly not a challenge every SoC design team faces. Methods to address this challenge typically involve a new process technology, a new library or both. Trusted, secure design is something more design teams worry about and that number is growing as our interconnected world creates new and significant… Read More


TSMC ISSCC 2021 Keynote Discussion

TSMC ISSCC 2021 Keynote Discussion
by Daniel Nenni on 03-01-2021 at 6:00 am

Mark Liu TSMC ISSCC 2021

Now that semiconductor conferences are virtual there are better speakers since they can prerecord and we have the extra time to do a better job of coverage. Even when conferences go live again I think they will also be virtual (hybrid) so our in depth coverage will continue.

ISSCC is one of the conferences we covered live since it’s… Read More


Probing UPF Dynamic Objects

Probing UPF Dynamic Objects
by Tom Simon on 01-28-2021 at 6:00 am

Probing UPF Dynamic Objects

UPF was created to go beyond what HDL can do for managing on-chip power. HDLs are agnostic when it comes to dealing with supply & ground connections, power domains, level shifters, retention and other power management related elements of SoCs. UPF fills the breach allowing designers to specify in detail what parts of the design… Read More


Samtec Lets You Learn from Home with a Great Webinar Lineup

Samtec Lets You Learn from Home with a Great Webinar Lineup
by Mike Gianfagna on 01-20-2021 at 10:00 am

Samtec Lets You Learn from Home with a Great Webinar Lineup

Work from home (WFH) has become a normal occurrence this past year. “Do you work from home?”  “Of course, where else?” Samtec is taking the whole work from home thing up a notch with a new webinar lineup for 2021. Back by popular demand, they are launching a new series of educational webinars. Started last year, the gEEk SpEEk Webinar… Read More


CES 2021 Goes All Digital

CES 2021 Goes All Digital
by Bill Jewell on 01-17-2021 at 8:00 am

2021 US Consumer Electronics

CES, the massive consumer technology show put on by the Consumer Technology Association (CTA), was held this week. Due to the global COVID-19 pandemic, CES 2021 was all digital. Last year, CES 2020 had over 170,000 attendees from over 160 countries and 4,400 exhibiting companies.

CES 2020 was held January 7-10, 2020 in Las Vegas,… Read More


CES 2021 and all things Cycling Technology

CES 2021 and all things Cycling Technology
by Daniel Payne on 01-17-2021 at 6:00 am

bowflex® velocore™ bike 940455

It’s January so time to give you another summary of what I’ve found at CES 2021 about new cycling products that have electronic content. During the pandemic in 2020 we’ve seen a surge in sales for bicycles, e-bikes, spin bikes and trainers as people wanted a simple way of getting around town running errands, or… Read More


ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era

ISS 2021 – Scotten W. Jones – Logic Leadership in the PPAC era
by Scotten Jones on 01-15-2021 at 6:00 am

Slide3

I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.

The title of the talk is “Logic Leadership in the PPAC era”.

The talk is broken up into three main sections:

  1. Background information explaining PPAC and Standard Cells.
  2. A node-by-node comparisons of companies running leading edge logic
Read More

The Latest in Dielectrics for Advanced Process Nodes

The Latest in Dielectrics for Advanced Process Nodes
by Tom Dillinger on 01-12-2021 at 6:00 am

new ILDs v2

Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention.  Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More


Webinar: Rescale is Providing an On-Ramp to the Hybrid Cloud for Chip Design

Webinar: Rescale is Providing an On-Ramp to the Hybrid Cloud for Chip Design
by Mike Gianfagna on 01-11-2021 at 6:00 am

Webinar Rescale is Providing an On Ramp to the Hybrid Cloud for Chip Design

We all know that design complexity is increasing at a fast pace. There’s always more analysis to run on larger and larger volumes of data. During tapeout, these demands can grow by an order of magnitude. Successful design projects need to add huge amounts of CPU, memory and storage for short bursts of time during tapeout to meet their… Read More