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At Veriest we host VERIFICATION MEETUPS periodically to share verification wisdom. In our virtual meetings we’ve had hundreds of attendants from the US, Europe, Israel, India, and China. Most recently we were able to host a live event in Israel – I want to share feedback from that meeting.
We started with two presentations:… Read More
At the 2021 Symposium on VLSI Technology and Circuits in June a short course was held on “Advanced Process and Devices Technology Toward 2nm-CMOS and Emerging Memory”. In this article I will review the first two presentations covering leading edge logic devices. The two presentations are complementary and provide and excellent… Read More
The successful transition to a new fabrication process from development to high volume manufacturing requires a collective, collaborative effort among process engineers, equipment manufacturers, and especially, chemical suppliers. Of particular importance is the chemistry of the photoresist materials and their interaction… Read More
Several years ago I recall upgrading my aging MacBook Pro laptop from using a Hard Disk Drive (HDD) to a Solid State Drive (SSD) that used Non-Volatile Memory (NVM). Oh what a speed improvement when pushing that On button each morning to start the work day, or clicking an App to see it launch without delay. Another epiphany for me in … Read More
Cadence hosted its annual CadenceLIVE Americas conference June 8th-June 9th. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.
The C-suite keynotes were delivered by Lip-Bu Tan (CEO) and Dr. Anirudh Devgan (President). The talks… Read More
Last week, Cadence hosted its annual CadenceLIVE Americas conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.
This blog is about the two keynotes delivered by CEO Lip-Bu Tan and President Dr. Anirudh Devgan. The guest … Read More
A couple of weeks ago, I blogged on GlobalFoundries’ silicon technologies supporting automotive radar applications. This time it is on GlobalFoundries’ silicon photonics technology which expects to find adoption in a broad spectrum of applications. The blog is based on listening to a technology presentation made by Dr. … Read More
At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps. Previous articles have reviewed the highlights of silicon process and packaging technologies. The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More
The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.
General
3DFabricTM
Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.
2.5D package technology – CoWoS
The 2.5D packaging options are divided into the CoWoS… Read More
Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap. This article will review the highlights of the silicon process developments and future release plans.
Subsequent articles will describe the packaging offerings and delve into technology … Read More
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Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era