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VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm

VLSI Symposium – TSMC and Imec on Advanced Process and Devices Technology Toward 2nm
by Scotten Jones on 07-02-2021 at 6:00 am

Figure 1

At the 2021 Symposium on VLSI Technology and Circuits in June a short course was held on “Advanced Process and Devices Technology Toward 2nm-CMOS and Emerging Memory”. In this article I will review the first two presentations covering leading edge logic devices. The two presentations are complementary and provide and excellent… Read More


Resist Development for High-NA EUV

Resist Development for High-NA EUV
by Tom Dillinger on 07-01-2021 at 10:00 am

EUV scaling

The successful transition to a new fabrication process from development to high volume manufacturing requires a collective, collaborative effort among process engineers, equipment manufacturers, and especially, chemical suppliers.  Of particular importance is the chemistry of the photoresist materials and their interaction… Read More


Webinar: Learn about NVMe conformance Testing

Webinar: Learn about NVMe conformance Testing
by Daniel Payne on 06-29-2021 at 6:00 am

QEMU min

Several years ago I recall upgrading my aging MacBook Pro laptop from using a Hard Disk Drive (HDD) to a Solid State Drive (SSD) that used Non-Volatile Memory (NVM). Oh what a speed improvement when pushing that On button each morning to start the work day, or clicking an App to see it launch without delay. Another epiphany for me in … Read More


Keynote from Air Force Research Laboratory at CadenceLIVE Americas 2021

Keynote from Air Force Research Laboratory at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-28-2021 at 6:00 am

Cadence Live Americas 2021

Cadence hosted its annual CadenceLIVE Americas conference June 8th-June 9th. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

The C-suite keynotes were delivered by Lip-Bu Tan (CEO) and Dr. Anirudh Devgan (President). The talks… Read More


Cadence Keynotes at CadenceLIVE Americas 2021

Cadence Keynotes at CadenceLIVE Americas 2021
by Kalar Rajendiran on 06-22-2021 at 10:00 am

LipBu 030 bizcasual

Last week, Cadence hosted its annual CadenceLIVE Americas conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.

This blog is about the two keynotes delivered by CEO Lip-Bu Tan and President Dr. Anirudh Devgan. The guest … Read More


Silicon Photonics Solutions Address Bandwidth, Reach, and Power Challenges

Silicon Photonics Solutions Address Bandwidth, Reach, and Power Challenges
by Kalar Rajendiran on 06-16-2021 at 10:00 am

MegaTrends and Silicon Photonics

A couple of weeks ago, I blogged on GlobalFoundries’ silicon technologies supporting automotive radar applications. This time it is on GlobalFoundries’ silicon photonics technology which expects to find adoption in a broad spectrum of applications.  The blog is based on listening to a technology presentation made by Dr. … Read More


Highlights of the TSMC Technology Symposium 2021 – Automotive

Highlights of the TSMC Technology Symposium 2021 – Automotive
by Tom Dillinger on 06-15-2021 at 6:00 am

automotive market growth v2

At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps.  Previous articles have reviewed the highlights of silicon process and packaging technologies.  The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More


Highlights of the TSMC Technology Symposium 2021 – Packaging

Highlights of the TSMC Technology Symposium 2021 – Packaging
by Tom Dillinger on 06-14-2021 at 6:00 am

3D Fabric

The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.

General

3DFabricTM

Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.

2.5D package technology – CoWoS

The 2.5D packaging options are divided into the CoWoS… Read More


Highlights of the TSMC Technology Symposium 2021 – Silicon Technology

Highlights of the TSMC Technology Symposium 2021 – Silicon Technology
by Tom Dillinger on 06-13-2021 at 6:00 am

logic technology roadmap

Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap.  This article will review the highlights of the silicon process developments and future release plans.

Subsequent articles will describe the packaging offerings and delve into technology … Read More


WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC

WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC
by Mike Gianfagna on 06-10-2021 at 6:00 am

WEBINAR 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC

If you are involved in designing systems that process data, you’re going to want to attend this webinar. Practically speaking, this should include a large percentage of the SemiWiki readership. Since data is the new oil there are a lot of applications drawn to data and information processing. Before we explore this webinar, let’s… Read More