CES 2023, the annual consumer technology show, was held last week in Las Vegas, Nevada. Over 115,000 people attended and over 3200 companies exhibited. As shown below, attendance and exhibitors were up about 2 ½ times the pandemic limited CES 2022. However, attendance was down one-third and exhibitors were down 27% from CES 2020.… Read More
CES 2023 and all things cycling
It’s January so time for me to review what I’ve found at CES this year that relates to cycling. Unlike last year when there were many last-minute cancellations from exhibitors, in 2023 it’s in-person and bigger than ever. The electrification of bikes continues, and many of these electronic devices are cloud… Read More
2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli
One of the first events on the 2023 EDA calendar is the Phil Kaufman Award ceremony and banquet honoring the 2022 recipient Dr. Giovanni De Micheli. The event, hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA), will be held Thursday, February 23, starting… Read More
IEDM 2022 – TSMC 3nm
TSMC presented two papers on 3nm at the 2022 IEDM; “Critical Process features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond” and “A 3nm CMOS FinFlexTM Platform Technology with Enhanced Power Efficiency and Performance for Mobile SOC and High Performance Computing Applications”.
When … Read More
Analog to Digital Converter Circuits for Communications, AI and Automotive
Sensors are inherently analog in nature, and they get digitized for processing by using an Analog to Digital Converter (ADC) block. At the recent IP SoC event I had the chance to see the presentation by Ken Potts, COO of Alphacore on their semiconductor IP for ADCs. I learned that Alphacore started out in 2012, now offering both standard… Read More
Webinar: Flexible, Scalable Interconnect for AI HW System Architectures
Building next generation systems is a real balancing act. The high-performance computing demands presented by increasing AI an ML content in systems means there are increasing challenges for power consumption, thermal load, and the never-ending appetite for faster data communications. Power, performance, and cooling … Read More
IEDM 2022 – Ann Kelleher of Intel – Plenary Talk
Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM, “Celebrating 75 Years of the Transistor A Look at the Evolution of Moore’s Law Innovation”. I am generally not a fan of plenary talks because I think they are often too broad and… Read More
Live Webinar: Code Review for System Architects
Register management tools have been used mostly in a bottom-up approach. There are some documents and/or spreadsheets created by the System Architects that are delivered to the design and verification teams. They then start capturing the HW/SW interface of the peripheral IPs in their in-house or commercial register management… Read More
Achieving 400W Thermal Envelope for AI Datacenter SoCs
Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More
INNOVA PDM, a New Era for Planning and Tracking Chip Design Resources is Born
No doubt that the design success of nowadays system on chips (SoCs) is directly linked to the success of cost control. More market opportunities are open for less expensive system on chips and electronic systems.
Both the design cost prediction and the resource tracking during the design process, are key to such a success
Predicting… Read More


Why ASML Is Racing to Build 110 EUV Machines