Heterogeneous integration (HI) is a general term used to represent the diverse possibilities for die technology incorporated into advanced 2.5D/3D packaging. At the recent International Electron Devices Meeting (IEDM) in San Francisco, a team from Synopsys and IC Knowledge presented data from analyses of future potential… Read More
Methodology for Aging-Aware Static Timing Analysis
At the recent Design Automation Conference, Cadence presented their methodology for incorporating performance degradation measures due to device aging into a static timing analysis flow. [1] (The work was a collaborative project with Samsung Electronics.) This article reviews the highlights of their presentation.
Background… Read More
Delivering Systemic Innovation to Power the Era of SysMoore
With the slowing down of Moore’s law , the industry as a whole has been working on various ways to maintain the rate of growth and advancements. A lot has been written up about various solutions being pursued to address specific aspects. The current era is being referred to by different names, SysMoore being one that Synopsys uses.… Read More
DAC 2021 – Taming Process Variability in Semiconductor IP
Tuesday at DAC was actually my very first time attending a technical session, and the presentation from Nebabie Kebebew, Siemens EDA, was called, Mitigating Variability Challenges of IPs for Robust Designs. There were three presentations scheduled for that particular Designer, IP and Embedded Systems track, but with the COVID… Read More
5 Talks on RISC-V
Veriest recently hosted a webinar focusing on RISC-V as a forerunner of ongoing open-source revolution in chip design. Speakers were distinguished professionals from industry and academia. Webinar covered topics from market trends to open-source hardware initiatives, tools and methodologies.
Zvonimir Bandić: RISC-V … Read More
More Than Moore and Charting the Path Beyond 3nm
The incredible growth that the semiconductor industry has enjoyed over the last several decades is attributed to Moore’s Law. While no one argues that point, there is also industry wide acknowledgment that Moore’s Law started slowing down around the 7nm process node. While die-size reductions still scale, performance jumps… Read More
DAC 2021 – Siemens EDA talks about using the Cloud
My third event at DAC on Monday was all about using EDA tools in the Cloud, and so I listened to Craig Johnson, VP EDA Cloud Solutions, Siemens EDA. Early in the day I heard from Joe Sawicki, Siemens EDA, on the topic of Digitalization.
Why even use the Cloud for EDA? That’s a fair question to ask, and Craig had several high-level… Read More
DAC 2021 Wrap-up – S2C turns more than a few heads
Now that the 58th Design Automation Conference held this year in San Francisco has concluded, we take a minute to look back at the results and ascertain what it meant for our company.
Unfortunately, many popular tradeshows held in the time of Covid have suffered a drop in attendance, and DAC was no exception. Despite this however,… Read More
Is Ansys Reviving the Collaborative Business Model in EDA?
The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More
Top 10 Takeaways from DAC 2021
The “in-person” portion of the Design Automation Conference (DAC) was recently held in San Francisco. (As several presenters were unable to attend, a “virtual” program is also available.) The presentations spanned a wide gamut – e.g., technical advanced in design automation algorithms; new features in commercial EDA tools; … Read More


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