The tremendous increase in global data traffic over the past decade shows no sign of abating. Indeed, the applications for all facets of data communications are expanding, from 5G (and soon, 6G) wireless communications to metropolitan area networks serving autonomous vehicles to broader deployment of machine learning algorithms. … Read More
Semiconductor Crash Update
Earlier this year semiconductor oracle Malcom Penn did his 2022 forecast which I covered here: Are We Headed for a Semiconductor Crash? The big difference with this update is the black economic clouds that are looming which may again highlight Malcolm’s forecasting prowess. I spent an hour with Malcolm and company on his Zoom cast… Read More
High-speed, low-power, Hybrid ADC at IP-SoC
Andrew Levy and I both worked at Intel and Opmaxx, and I knew that he was now working at Alphacore, an IP company specializing in mixed-signal, RF, imaging and rad-hard applications. I was curious what Alphacore was up to, so at the IP-SoC Silicon Valley 2022 event I watched the ADC presentation from Ken Potts, COO of Alphacore. Mr.… Read More
WEBINAR: Challenges in analyzing High Performance clocks at 7nm and below process nodes
Proper clock functionality and performance are essential for SoC operation. Static timing analysis (STA) tools have served well for verifying clocks, yet with new advanced process nodes, lower operating voltages, higher clock speeds and higher reliability requirements, STA tools alone can’t perform the kinds of analysis… Read More
Designing Ultra-Low-Power, Always On IP
It’s popular to use DSP chips for vision processing in diverse applications like ADAS, security cameras and AR. Tensilica has been designing DSP chips and IP since 1997, and their technology was successful enough that Cadence acquired Tensilica back in 2013. At the IP-SoC Silicon Valley 2022 event in April I had the pleasure… Read More
Advantages of Large-Scale Synchronous Clocking Domains in AI Chip Designs
We are currently in the hockey stick growth phase of AI. Advances in artificial intelligence (AI) are happening at a lightning pace. And, while the rate of adoption is exploding, so is model size. Over the past couple of years, we’ve gone from about two billion parameters to Google Brain’s recently announced trillion-parameter… Read More
Tensilica Edge Advances at Linley
The Linley spring conference this year had a significant focus on AI at the edge, with all that implies. Low power/energy is a key consideration, though increasing performance demands for some applications are making this more challenging. David Bell (Product Marketing at Tensilica, Cadence) presented the Tensilica NNE110… Read More
Bigger, Faster and Better AI: Synopsys NPUs
AI-based applications are fast advancing with evolving neural network (NN) models, pushing aggressive performance envelopes. Just a few years ago, performance requirements of NN driven applications were at 1 TOPS and less. Current and future applications in the areas of augmented reality (AR), surveillance, high-end smartphones,… Read More
Future.HPC is Coming!
According to the experts, the semiconductor industry is poised for a decade of growth and is projected to become a trillion dollar industry by 2030. In 2021 the semiconductor industry finally hit $600B so $1T by 2030 seems like a big ask, but not really if you look at the indicators inside the semiconductor ecosystem. Foundries, … Read More
IP Subsystems and Chiplets for Edge and AI Accelerators
From a business viewpoint we often read in the technical press about the virtues of applying AI, and in the early days most of the AI model building was done in the cloud, because of the high computation requirements, yet there’s a developing trend now to use AI accelerators at the Edge. The other mega-trend in the past decade… Read More


AI Bubble?