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PCIe, or peripheral component interconnect express, is a very popular high-speed serial computer expansion bus standard. The width and speed the standard supports essentially defines the throughput for high-performance computing (HPC) applications. The newest version, PCIe 6.0 promises to double the bandwidth that the… Read More
The 38th Design Automation Conference is next week and this one is for the record books. Having been virtual the last two years, next week we will meet live once again. I think we may have all taken for granted the value of live events but now we know how important they are on both a professional and human level, absolutely.
“The… Read More
Each year, Silicon Catalyst assembles a panel of industry luminaries to discuss important questions about the future. The charter of the Silicon Catalyst Industry Forum is to: “create a platform for broad-topic dialog among all stakeholders involved in the semiconductor industry value chain. The Forum topics focus on technical… Read More
There have always been good reasons to port designs to new foundries or processes. These reasons have included reusing IP in new projects, moving an entire design to a smaller node to improve PPA, or second sourcing manufacturing. While there can be many potential business motivations for any of the above, in today’s environment… Read More
By any measure analog circuit design is a difficult and complex process. This point is driven home in a recent webinar by MunEDA. Michael Pronath, VP Products and Solutions at MunEDA, lays out why, even with the assistance of simulators, analog circuit sizing and tuning can consume weeks of time in what can potentially be a non-convergent… Read More
This is an interesting piece of TSMC history. From 1987 to 1988 James E. Dykes served as the first President and Chief Executive Officer of Taiwan Semiconductor Manufacturing Company Ltd.
Taiwan Semiconductor Outlook
by James E. Dykes
President & Chief Executive Officer
Taiwan Semiconductor Manufacturing Company
Given… Read More
There’s plenty of talk about requirements for IP data management. The fundamental methods to prevent chaos, waste or worse are popular topics. I’ve covered webinars from Cliosoft on the topic on SemiWiki. But what about the future? What’s really needed to set up a path that scales, addressing the challenges of today and the new … Read More
The TSMC Open Innovation Platform (OIP) event brings together a wide array of companies reporting cutting edge work that are part of TSMC’s rather substantial ecosystem. The event covers everything from high-performance computing to mobile, automotive, IoT, RF and 3D IC design. Of particular interest for this post is a presentation… Read More
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
Overview of 3D Fabric
The TSMC… Read More
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
One of the topics that L.C. … Read More
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Facing the Quantum Nature of EUV Lithography