SILVACO 051525 Webinar 800x100 v2
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Hogan University: Second Semester

Hogan University: Second Semester
by Paul McLellan on 09-11-2012 at 7:37 pm

The next event in the Jim Hogan Emerging Companies series (organized by the EDAC Emerging Companies Committee) will be on 17th October at Cadence (I’m guessing in building 5 but I’m sure there will be signs). The specific topic this time will be How to Raise Money and How Not to Spend it. The evening will focus on different… Read More


17th Si2 Conference – October 9 – Santa Clara, CA

17th Si2 Conference – October 9 – Santa Clara, CA
by Daniel Nenni on 09-11-2012 at 8:30 am

This conference will begin with a keynote address by my good friend Jim Hogan, EDA industry pioneer and venture capitalist. Jim has worked in the semiconductor design and manufacturing industry for more than 35 years and is very candid about his experience and vision for the future of EDA. This keynote and Q&A alone is worth … Read More


DAC 2012 Cheerleader Controversy!

DAC 2012 Cheerleader Controversy!
by Daniel Nenni on 07-08-2012 at 9:00 pm

First, I must say that I’m biased. I like Cheerleaders, they are lots of fun, I even married one. Second, I’m not a fan of Peggy Aycinena. She has been on her EDA feminist rant for years now and I have been targeted multiple times. My solution has been to ignore her and any publication that supports her but this time she has gone too far.… Read More


Robustness, Reliability and Yield at DAC

Robustness, Reliability and Yield at DAC
by Daniel Payne on 06-26-2012 at 8:15 pm

On Wednesday at DAC I met with Bob Slee, distributor and Michael Siu, AE for MunEDA to get an update on what’s new. MunEDA has EDA software for:

  • Schematic porting
  • Nominal circuit analysis
  • Nominal circuit optimization
  • Statistical circuit analysis
  • Statistical circuit optimization
  • IP porting
  • Circuit model generation
Read More

FinFET Standard Cells at DAC

FinFET Standard Cells at DAC
by Daniel Payne on 06-25-2012 at 11:45 am

Rajiv Bhateja, Dhrumil Gandhi and Neal Carney met with me at DAC on Wednesday to give an update on what’s new in 2012 for Tela Innovations, a provider of lithography optimized IP and tools. This team has a rich history in EDA and IP from companies like: ARM, Artisan, Mentor Graphics and Silicon Compilers.… Read More


Finding RTL Bugs Live Using Formal Techniques

Finding RTL Bugs Live Using Formal Techniques
by Daniel Payne on 06-24-2012 at 8:10 pm

Most of what you see at DAC is canned PowerPoint presentations, however on Tuesday afternoon I spotted a company called Oski Technology that was doing something almost unheard of – they had an engineer debugging a digital design from Nvidia using formal tools live. I later found out the engineer found 4 bugs in just three days… Read More


3D Thermal and Mechanical Stress for IC Packaging

3D Thermal and Mechanical Stress for IC Packaging
by Daniel Payne on 06-19-2012 at 8:02 pm

3D has been a growing buzz word in IC design and packaging for several years now, so it’s refreshing to actually find an EDA vendor that has developed tools to help analyze something like 3D thermal and mechanical stress at DAC. … Read More