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Someone once said that IoT devices live in the wild. They must be able to withstand any number of attacks, whether they be communication, physical or software based attacks. The threats are real and the consequences can range from simple irritants to life threatening situations.
It’s because of these threats that IoT device designers… Read More
Apparently this event is now being postponed until sometime later in the year. Stay tuned
We spend a lot of our time with our heads down in the technical details and when we look up at what we think is the big picture, it’s usually just a little bit bigger, often no more than a justification for immediate product directions. So wouldn’t… Read More
The SPIE Advanced Lithography Conference is the world’s leading conference addressing photolithography. This year on the opening day of the conference, Samsung and Intel presented papers summarizing the readiness of EUV for high volume manufacturing (HVM). In this article, I will begin by summarizing the EUV plans … Read More
At the ISS Conference in January, An Steegen EVP of Semiconductor Technology & Systems at imec gave a talk entitled “Patterning Options for Advanced Technology Nodes”. I was present for her talk and had the opportunity to have a follow up interview with An.… Read More
The annual SPIE Advanced Lithography Conference kicked off last night with vendor sponsored networking events and such. SPIE is the international society for optics and photonics but this year SPIE Advanced Lithography is all about the highly anticipated EUV technology. Scotten Jones and I are at SPIE so expect more detailed… Read More
When you think about working with an ASIC service provider like Open-Silicon, you probably think about handling all the architecture, design and verification/validation in your shop, handing over a netlist and some other collateral, then the ASIC services provider takes responsibility for implementation and manufacturing.… Read More
Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which are… Read More
Out of college my first job was doing circuit design at the transistor-level with Intel, and to get accurate SPICE netlists for simulation we had to manually count the squares of parasitic interconnect for diffusion, poly-silicon and metal layers. Talk about a burden and chance for mistakes, I’m so thankful that EDA companies… Read More
The engineering team for the design and analysis of a complex system consists of a diverse set of skills — with the increasing emphasis on both high-speed interface design and multi-domain power management, a critical constituent of the team is the group of signal integrity (SI) and power integrity (PI) engineers.
The training… Read More
You’d expect Mentor to be covering a lot of bases at DVCon and you wouldn’t be wrong. They’re hosting tutorials, a lunch, papers, posters, there’s a panel and of course they’ll be on the exhibit floor. I’ll start with an important tutorial that you really should attend, Monday morning, on creating Portable Stimulus Models… Read More
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TSMC Technology Symposium 2026 Overview