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Q2FY24TessentAI 800X100
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Graphical DRC vs Text-based DRC

Graphical DRC vs Text-based DRC
by Daniel Payne on 05-01-2011 at 11:42 am

Introduction
IC designs go through a layout process and then a verification of that layout to determine if the layout layer width and spacing rules conform to a set of manufacturing design rules. Adhering to the layout rules will ensure that your chip has acceptable yields.

At the 28nm node a typical DRC (Design Rule Check) deck will… Read More


Ivo Bolsens of Xilinx and Crossover Designs

Ivo Bolsens of Xilinx and Crossover Designs
by Paul McLellan on 04-27-2011 at 4:14 pm

I was at Mentor’s u2u (user group) meeting and one of the keynotes was by Ivo Bolsens of Xilinx. The other was by Wally Rhines and is summarized here.

Ivo started off talking analogizing SoCs as the sports-cars of the industry (fast but expensive), and FPGAs as the station wagons (not cool). In fact he even said that when Xilinx… Read More


Wally’s u2u keynote

Wally’s u2u keynote
by Paul McLellan on 04-27-2011 at 3:25 pm

I was at Wally’s u2u (Mentor user group) keynote yesterday. The other keynote was by Ivo Bolsens of Xilinx and is here. He started off by looking at how the semiconductor industry has recovered and silicon area shipments are now back on trend after a pronounced drop in 2009 and revenue has followed. Finally the semiconductor… Read More


Transistor-Level Electrical Rule Checking

Transistor-Level Electrical Rule Checking
by Daniel Payne on 04-20-2011 at 11:19 am

Introduction
Circuit designers work at the transistor level and strive to get the ultimate in performance, layout density or low power by creating crafty circuit topologies in both schematics and layout. Along with this quest comes the daunting task of verifying that all of your rules and best practices about reliability have… Read More


Who Needs a 3D Field Solver for IC Design?

Who Needs a 3D Field Solver for IC Design?
by Daniel Payne on 04-07-2011 at 4:53 pm

Inroduction
In the early days we made paper plots of an IC layout then measured the width and length of interconnect segments with a ruler to add up all of the squares, then multiplied by the resistance per square. It was tedious, error prone and took way too much time, but we were rewarded with accurate parasitic values for our SPICE… Read More


DRC/DFM inside of Place and Route

DRC/DFM inside of Place and Route
by Daniel Payne on 03-31-2011 at 10:19 am

Intro
Earlier this month I drove to Mentor Graphics in Wilsonville, Oregon and spoke with Michael Buehler-Garcia, Director of Marketing and Nancy Nguyen, TME, both part of the Calibre Design to Silicon Division. I’m a big fan of correct-by-construction thinking in EDA tools and what they had to say immediately caught my… Read More


Dawn at the OASIS, Dusk for GDSII

Dawn at the OASIS, Dusk for GDSII
by Beth Martin on 03-28-2011 at 1:53 pm

For an industry committed to constant innovation, changes in any part of the design flow are only slowly adopted, and only when absolutely necessary. Almost 10 years ago, it became clear that shrinking process technologies would bring a massive growth of layout and mask data—rougly 50% per node. This avalanche of data seriously… Read More


Evolution of Lithography Process Models, Part II

Evolution of Lithography Process Models, Part II
by Beth Martin on 03-24-2011 at 3:56 pm

In part I of this series, we looked at the history of lithography process models, starting in 1976. Some technologies born in that era, like the Concorde and the space shuttle, came to the end of their roads. Others did indeed grow and develop, such as the technologies for mobile computing and home entertainment. And lithography … Read More


Getting Real Time Calibre DRC Results

Getting Real Time Calibre DRC Results
by Daniel Payne on 03-10-2011 at 10:00 am

Last week I met with Joseph Davis, Ph.D. at Mentor Graphics in Wilsonville, Oregon to learn about a new product designed for full-custom IC layout designers to improve productivity.

The traditional flow for full-custom IC layout designers has been nearly unchanged for decades:

  • Read a schematic or use Schematic Driven Layout
Read More

With EUVL, Expect No Holiday

With EUVL, Expect No Holiday
by Beth Martin on 03-02-2011 at 1:12 pm

For a brief time in the 1990s, when 4X magnification steppers suddenly made mask features 4X larger, there was a period in the industry referred to as the “mask vendor’s holiday.” The party ended before it got started with the arrival of sub-wavelength lithography, and we all trudged back to the OPC/RET mines. Since then, the demands… Read More