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Is Ansys Reviving the Collaborative Business Model in EDA?

Is Ansys Reviving the Collaborative Business Model in EDA?
by Daniel Nenni on 12-16-2021 at 10:00 am

Evolution of Multiphysics Complexity

The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More


Top 10 Takeaways from DAC 2021

Top 10 Takeaways from DAC 2021
by Tom Dillinger on 12-15-2021 at 2:00 pm

stopped clock license model

The “in-person” portion of the Design Automation Conference (DAC) was recently held in San Francisco.  (As several presenters were unable to attend, a “virtual” program is also available.)  The presentations spanned a wide gamut – e.g., technical advanced in design automation algorithms;  new features in commercial EDA tools; … Read More


DAC 2021 – Joe Sawicki explains Digitalization

DAC 2021 – Joe Sawicki explains Digitalization
by Daniel Payne on 12-13-2021 at 10:00 am

semiconductor content min

Monday at DAC this year started off on a very optimistic note as Joe Sawicki from Siemens EDA presented in the Pavilion on the topic of Digitalization, a frequent theme in the popular press because of the whole Work From Home transition that we’ve gone through during the pandemic. Several industries are benefiting from the… Read More


A Practical Approach to Better Thermal Analysis for Chip and Package

A Practical Approach to Better Thermal Analysis for Chip and Package
by Daniel Nenni on 12-13-2021 at 6:00 am

ANSYS Thermal Chip Model

Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory ControllerRead More


Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum

Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum
by Tom Simon on 12-09-2021 at 10:00 am

Ajei Gopal talks about 3D IC

System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development.  Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More


Live 58th Design Automation Conference Coverage!

Live 58th Design Automation Conference Coverage!
by Daniel Nenni on 12-05-2021 at 10:00 am

Dan and Shushana Friday Harbor San Juan Islands

My beautiful first mate and I will be together at DAC this year. Her first DAC was 1985 in Las Vegas and we lived happily ever after. SemiWiki bloggers Tom Dillinger and Daniel Payne will also be at DAC attending sessions and meeting with exhibiting companies to learn and blog about the latest innovations inside the semiconductor … Read More


A Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development

A Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development
by Kalar Rajendiran on 12-05-2021 at 6:00 am

Corigine Prototyping Systems

Every now and then, disruptive technology is brought to market, challenging the way things have been done to that point. We are all familiar with many such technologies. The rhetorical question is, how many of us were aware, recognized and acknowledged those technologies before they became well established? For example, a startup… Read More


Continuous Integration of RISC-V Testbenches

Continuous Integration of RISC-V Testbenches
by Daniel Nenni on 12-02-2021 at 6:00 am

RISC V Results

In my last blog post about AMIQ EDA, I talked with CEO and co-founder Cristian Amitroaie about their support for continuous integration (CI). We discussed in some detail how their Design and Verification Tools (DVT) Eclipse Integrated Development Environment (IDE) and Verissimo SystemVerilog Linter are used in CI flows. Cristian… Read More


Ansys to Present Multiphysics Cloud Enablement with Microsoft Azure at DAC

Ansys to Present Multiphysics Cloud Enablement with Microsoft Azure at DAC
by Daniel Nenni on 12-01-2021 at 2:00 pm

Picture1 1

Ansys and Microsoft  collaborated extensively over the past year to optimize and test Ansys’ signoff multiphysics simulation tools on the Azure cloud. Microsoft has invited Ansys to present the joint results in Azure’s DAC booth theater in San Francisco this year.

Two presentations are planned: covering the enablement of AnsysRead More