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Electronic Design Automation
Before I get too snarky here, I would like to thank Synopsys for the invitation to SNUG 2012 and including me with the professional editors at a 75 minute roundtable discussion with Synopsys CEO Aart de Geus. While Aart is not my favorite big EDA CEO (Wally Rhines of Mentor bought me lunch and returns my email), he is definitely the most… Read More
And no red and green glasses required.
I remember the first time I heard about a Through Silicon Via (TSV), punching a hole through the entire wafer to make an electrical connection at the back, like we do all the time in printed circuit boards with through plated holes. I thought someone was trying one on and trying to make me look a fool.… Read More
Lip-Bu Tan, the CEO of Cadence, has been named by the Singapore Business Awards as Outstanding CEO (overseas) last week. These awards were launched in 1985 by the Business Times and DHL, so this year is the 27th year of the award, created to recognize business leaders in Singapore and abroad.
As it happens, Cadence flew me first class… Read More
The verification IP (VIP) for Non-Volatile Memory Express (NVMe) announcement from Synopsys is the first fruit issued from the acquisition of ExpertIO. With the proliferation of Nand Flash based storage equipment, or Solid State Drives (SSD), the move from pure SATA based solution was to be expected, sooner or later. Not because… Read More
Next week is a big deal because it’s when Synopsys has their annual user group meeting, SNUG in Santa Clara at the Convention Center from Monday through Wednesday. I’d love to hear if they have made any decisions on the new product roadmap after the Magma acquisition, although it’s probably too early to tell.… Read More
In my last article I talked about the physical design aspect of 3D-IC. Now looking at its verification aspect, it spans through a wide spectrum of test at hardware as well as software level. The verification challenge goes much beyond that of a SoC which is at a single plane. Even a typical SoC that comprises of a processor core, memory… Read More
The launch from Cadence of the PCI Express 3.0 Controller IP was officially done about one year ago, and demonstrated at the June 2011 PCI-SIG Developer’s Conference, where Cadence Design IP for PCI Express 3.0 controller IP implemented as a high-performance, dual-mode, 128-bit data-path, x8 PCI Express 3.0 controller… Read More
John Stabenow is the marketing group director at Cadence for the Virtuoso products and it has been awhile since we last talked, so we met for lunch on Friday at McMenamins in a city called West Linn, half-way between where we both live in Oregon. I had blogged about Interoperability at DAC 2010 and we had a public exchange at Chip Design… Read More
Every year in Monterey is a relatively small conference that looks at the design process, EDPS, the electronic design process symposium. I gave a keynote there a couple of years ago, but you don’t have to listen to me this time. The keynotes are from:
I went to a couple more sessions at the Common Platform Technology Forum today, on 20nm double patterning and whatever will we do at 14nm. Basically, this is the end of planar transistors and the end of optical lithography. One session was by IBM scientists about process and one by Michael White of Mentor about double patterning. … Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot