This morning I attended a webinar about MEMS and IC co-design from a company called SoftMEMS along with Tanner EDA. I learned that you can co-design MEMS and IC either in a bottom-up or top-down methodology, and that this particular flow has import/export options to fit in with your mechanical simulation tools (Ansys, Comsol, Open… Read More
Electronic Design Automation
Oasys Gets Funding from Intel and Xilinx
Oasys announced that it closed its series B funding round with investments from Intel Capital and Xilinx. The fact that any EDA company has closed a funding round is newsworthy these days; companies running out of cash and closing the doors seems to be a more common story.
Oasys has been relatively quiet, which some people have taken… Read More
EDPS: Parallel EDA
EDPS was last Thursday and Friday in Monterey. I think that this is a conference that more people would benefit from attending. Unlike some other conferences, it is almost entirely focused around user problems rather than doing a deep dive into things of limited interest. Most of the presentations are more like survey papers and… Read More
Designing for Reliability
Analyzing the operation of a modern SoC, especially analyzing its power distribution network (PDN) is getting more and more complex. Today’s SoCs no longer operate on a continuous basis, instead functional blocks on the IC are only powered up to execute the operation that is required and then they go into a standby mode, … Read More
Synopsys Users Group 2012 Keynote: Dr Chenming Hu and Transistors in the Third Dimension!
It was an honor to see DR. Chenming Huspeak and to learn more about FinFets, a technology he has championed since 1999. Chenming is considered an expert on the subject and is currently a TSMC Distinguished Professor of Microelectronics at University of California, Berkeley. Prior to that he was the Chief Technology Officer of TSMC.… Read More
Does Subsystem IP will finally find a market? ARC based sound subsystem IP is on track…
Will the launch of ARC based complete sound system IP by Synopsys ring the bell for the opening of a new IP market segment, the “Subsystem IP”? If you look at the IP market evolution, starting from standard cell libraries and memory compiler offering in the 1990’s, moving to commodity functions like UART or I2C in the late 1990’s to … Read More
DAC Pavilion Panels
Once again DAC has a full program of panel sessions that take place on the exhibit floor at the DAC pavilion, aka booth 310.
Gary Smith kicks off the program with his annual “What’s Hot at DAC” presentation on Monday, June 4th, from 9:15-10:15am. The rest of Monday’s pavilion panels are:
- “Low power to the people,” a panel discussing
U2U Mentor Users’ Group
Mentor’s U2U user group meeting in Santa Clara is next week on April 12th at the Santa Clara Marriott. For those of you on the east coast the Waltham U2U is on May 16th, and for Europeans the Munich U2U will be on October 25th. Registration is open for both Santa Clara and Waltham, and there is a call for papers for Munich.
The day … Read More
How Co-design of MEMS-IC Saves Time
I learned about MEMS layout automation at a webinar in December and plan to attend another webinar next week on April 10thwhere two companies have created a MEMS-IC co-design flow, Tanner EDA and SoftMEMS. The big challenge is to ensure that the MEMS and electronic parts of a new design will simulate correctly before committing … Read More
Jasper Asian Seminars
Jasper has three seminars coming up in May in Hsinchu (Taiwan), Beijing and Shanghai. These are full-day seminars on how to solve critical verification challenges using state-of-the-art formal technology. Breakfast and lunch will be served.
This full-day tutorial will be given by technical experts for verification experts… Read More
The Data Crisis is Unfolding – Are We Ready?